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薄板激光弯曲温度场的数值模拟与校验

王秀凤 吕晓东 胡世光 陈光南

王秀凤, 吕晓东, 胡世光, 等 . 薄板激光弯曲温度场的数值模拟与校验[J]. 北京航空航天大学学报, 2003, 29(5): 377-381.
引用本文: 王秀凤, 吕晓东, 胡世光, 等 . 薄板激光弯曲温度场的数值模拟与校验[J]. 北京航空航天大学学报, 2003, 29(5): 377-381.
Wang Xiufeng, Lü Xiaodong, Hu Shiguang, et al. Simulation and Verification of the Temperature Field in Laser Bending Sheet Metal[J]. Journal of Beijing University of Aeronautics and Astronautics, 2003, 29(5): 377-381. (in Chinese)
Citation: Wang Xiufeng, Lü Xiaodong, Hu Shiguang, et al. Simulation and Verification of the Temperature Field in Laser Bending Sheet Metal[J]. Journal of Beijing University of Aeronautics and Astronautics, 2003, 29(5): 377-381. (in Chinese)

薄板激光弯曲温度场的数值模拟与校验

基金项目: 国家自然科学基金资助项目(59836220); 航空基础科学基金资助项目(98H51110)
详细信息
    作者简介:

    王秀凤 (1963-),女,北京人,副教授,100083,北京.

  • 中图分类号: TN 249; TG 386.3+1

Simulation and Verification of the Temperature Field in Laser Bending Sheet Metal

  • 摘要: 采用MSC.Marc非线性有限元软件,对薄板激光弯曲过程中的温度场进行了数值模拟 ,得到了引起薄板激光弯曲变形的温度场的变化规律.通过温度传感器测量与激光扫描线相 对应的薄板下表面温度变化的规律来验证数值模拟的结果.模拟值与实测值基本吻合,表明 数值模拟结果可作为激光加工工艺参数选择的依据.

     

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出版历程
  • 收稿日期:  2001-09-10
  • 网络出版日期:  2003-05-31

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