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纳米银膏与微米银膏烧结连接对比

朱颖 唐善平 闫剑锋 邹贵生

朱颖, 唐善平, 闫剑锋, 等 . 纳米银膏与微米银膏烧结连接对比[J]. 北京航空航天大学学报, 2013, 39(4): 484-487.
引用本文: 朱颖, 唐善平, 闫剑锋, 等 . 纳米银膏与微米银膏烧结连接对比[J]. 北京航空航天大学学报, 2013, 39(4): 484-487.
Zhu Ying, Tang Shanping, Yan Jianfeng, et al. Comparation of the bonding through sintering between Ag nanoparticle paste and Ag microparticle paste[J]. Journal of Beijing University of Aeronautics and Astronautics, 2013, 39(4): 484-487. (in Chinese)
Citation: Zhu Ying, Tang Shanping, Yan Jianfeng, et al. Comparation of the bonding through sintering between Ag nanoparticle paste and Ag microparticle paste[J]. Journal of Beijing University of Aeronautics and Astronautics, 2013, 39(4): 484-487. (in Chinese)

纳米银膏与微米银膏烧结连接对比

基金项目: 国家自然科学基金资助项目(51075232)
详细信息
  • 中图分类号: TB 31

Comparation of the bonding through sintering between Ag nanoparticle paste and Ag microparticle paste

  • 摘要: 用粒径20~80nm的纳米银膏和粒径1~3μm的微米银膏进行了烧结连接镀银铜块的对比实验.借助热/力物理模拟试验机Gleeble 1500D对接头剪切强度进行了测定.用扫描电镜及能谱分析仪对接头的微观组织进行了观察和分析.结果表明:在相同的连接条件下纳米银膏烧结连接的剪切强度明显高于微米银膏烧结连接的剪切强度.接头断口和显微组织分析表明,在相同条件下,纳米银膏烧结接头组织的质密性好于微米银膏烧结接头的组织质密性.在微米银连接接头中,由于Cu块-烧结银层间的界面处存在裂纹,其剪切强度较低.

     

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出版历程
  • 收稿日期:  2012-05-14
  • 网络出版日期:  2013-04-30

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