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基于响应面方法的印制电路板模型修正

徐飞 李传日 姜同敏

徐飞, 李传日, 姜同敏等 . 基于响应面方法的印制电路板模型修正[J]. 北京航空航天大学学报, 2015, 41(3): 449-455. doi: 10.13700/j.bh.1001-5965.2014.0219
引用本文: 徐飞, 李传日, 姜同敏等 . 基于响应面方法的印制电路板模型修正[J]. 北京航空航天大学学报, 2015, 41(3): 449-455. doi: 10.13700/j.bh.1001-5965.2014.0219
XU Fei, LI Chuanri, JIANG Tongminet al. Printed circuit board model updating based on response surface method[J]. Journal of Beijing University of Aeronautics and Astronautics, 2015, 41(3): 449-455. doi: 10.13700/j.bh.1001-5965.2014.0219(in Chinese)
Citation: XU Fei, LI Chuanri, JIANG Tongminet al. Printed circuit board model updating based on response surface method[J]. Journal of Beijing University of Aeronautics and Astronautics, 2015, 41(3): 449-455. doi: 10.13700/j.bh.1001-5965.2014.0219(in Chinese)

基于响应面方法的印制电路板模型修正

doi: 10.13700/j.bh.1001-5965.2014.0219
详细信息
    作者简介:

    徐飞(1987—),男,江苏盐城人,博士生,luoyefeihen@163.com

    通讯作者:

    李传日(1964—),男,福建邵武人,教授,lichuanri@buaa.edu.cn,主要研究方向为环境试验、振动与冲击试验.

  • 中图分类号: TP391.9

Printed circuit board model updating based on response surface method

  • 摘要: 近年来,基于响应面的优化分析技术被用于有限元模型修正.给出了基于响应面方法的印制电路板(PCB,Printed Circuit Board)模型修正过程.首先利用ANSYS计算PCB的前6阶模态频率并与模态试验结果进行相关性分析;然后分别利用有限元分析和模态试验的前3阶模态频率构造3个目标函数,再利用前6阶共振频率的残差平方和构造第4个目标函数,每个共振频率的权重相同;最后利用多目标函数遗传算法进行优化分析,使得4个目标函数最小化.给出了一个案例对上述的修正过程进行了阐述.分析结果表明,基于响应面的模型修正技术可用于改善PCB的有限元模型,且可利用已有的商业有限元软件直接进行分析,易于工程应用.

     

  • [1] Baruch M. Optimization procedure to correct stiffness and flexibility matrices using vibration tests[J].AIAA Journal,1978,16(11): 1208-1210.
    [2] Baruch M, Bar Itzhack I Y.Optimal weighted orthogonalization of measured modes[J].AIAA Journal,1978,16(4):346-351.
    [3] Baruch M. Methods of reference basis for identification of linear dynamic structures[J].AIAA Journal,1984,22(4):561-564.
    [4] Berman A. Optimal weighted orthogonalization of measured modes-comment[J].AIAA Journal,1979,17(8): 927-928.
    [5] Berman A, Nagy E J.Improvement of a large analytical model using test data[J].AIAA Journal,1983,21(8):1168-1173.
    [6] Fox R, Kapoor M,Rate of change of eigenvalues and eigenvectors[J].AIAA Journal,1968,6(12)2426-2429.
    [7] Mottershead J E, Friswell M I.Model updating in structural dynamics:a survey[J].Journal of Sound and Vibration,1993,167(2) :347-375.
    [8] Friswell M I, Mottershead J E.Finite element model updating in structural dynamics[M].Dordrecht:Kluwer Academic Publishers,1995:158-256.
    [9] Natke H G, Lallement G,Cottin N.Properties of various residuals within updating of mathematical models[J].Inverse Problems in Engineering,1995,1(4)329-348.
    [10] Khodaparast H H, Mottershead J E,Friswell M I.Perturbation methods for the estimation of parameter variability in stochastic model updating[J].Mechanical Systems and Signal Processing,2008,22(8):1751-1773.
    [11] Shahverdi H, Mares C,Wang W,et al.Clustering of parameter sensitivities:examples from a helicopter airframe model updating exercise[J].Shock and Vibration,2009,16(1):75-88.
    [12] Mottershead J E, Link M,Friswell M I.The sensitivity method in finite element model updating:a tutorial[J].Mechanical Systems and Signal Processing,2011,25(7):2275-2296.
    [13] Ren W X, Fang S E,Deng M Y.Response surface-based finite-element-model updating using structural static responses[J].Journal of Engineering Mechanics,2010,137(4):248-257.
    [14] Ren W X, Chen H B.Finite element model updating in structural dynamics by using the response surface method[J].Engineering Structures,2010,32(8):2455-2465.
    [15] Zhou L R, Yan G R,Ou J P.Response surface method based on radial basis functions for modeling large-scale structures in model updating[J].Computer-Aided Civil and Infrastructure Engineering,2013,28(3):210-226.
    [16] Pitarresi, J M.Modeling of printed circuit cards subject to vibration[C]//IEEE Proceedings of the Circuits and Systems Conference.Piscataway,NJ:IEEE,1990,3:2104-2107.
    [17] Pitarresi J M, Celetka D,Coldwel R,et al.The smeared properties approach to FE vibration modeling of printed circuit cards[J].ASME Journal of Electronics Packaging,1991,113(3)250-257.
    [18] Pitarresi J M, Primavera A.Comparison of vibration modeling techniques for printed circuit cards[J].Journal of Electronic Packaging,1992,114(4)378-383.
    [19] Lim G, Ong J,Penny J.Effect of edge and internal point support of a printed circuit board under vibration[J].ASME Journal of Electronic Packaging,1999,121(2)122-126.
    [20] Deiter A, Baker M.Using analysis to design for drop or other shock environment[J].Sound & Vibration,2000,36(10):26-30.
    [21] Li R S. A methodology for fatigue prediction of electronic components under random vibration load[J]Transactions of the ASME,2001,123(4)394-400.
    [22] Amy R A, Aglietti G S,Richardson G.Sensitivity analysis of simplified printed circuit board finite element models[J].Microelectronics reliability,2009,49(7):791-799.
    [23] Amy R A, Aglietti G S,Richardson G.Accuracy of simplified printed circuit board finite element models[J].Microelectronics Reliability,2010,50(1):86-97.
    [24] 刘孝保,杜平安, 夏汉良,等.一种面向动态分析的PCB板等效建模方法[J].仪器仪表学报,2011,32(4):863-869. Liu X B,Du P A,Xia H L,et al.Dynamic property analysis-oriented PCB equivalent modeling method[J].Chinese Journal of Scientific Instrument,2011,32(4):863-869(in Chinese).
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出版历程
  • 收稿日期:  2014-04-22
  • 网络出版日期:  2015-03-20

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