北京航空航天大学学报 ›› 2017, Vol. 43 ›› Issue (12): 2406-2415.doi: 10.13700/j.bh.1001-5965.2016.0847

• 论文 • 上一篇    下一篇

三维TSV集成电路电磁敏感性分析方法

秦海潮, 阎照文, 苏东林, 张伟   

  1. 北京航空航天大学 电子信息工程学院, 北京 100083
  • 收稿日期:2016-11-03 修回日期:2016-12-16 出版日期:2017-12-20 发布日期:2017-04-07
  • 通讯作者: 阎照文 E-mail:yanzhaowen@buaa.edu.cn
  • 作者简介:秦海潮,男,博士研究生。主要研究方向:电磁兼容;阎照文,男,博士,教授,博士生导师。主要研究方向:电磁兼容和信号完整性分析;苏东林,女,博士,教授,博士生导师。主要研究方向:电磁兼容;张伟,女,硕士研究生。主要研究方向:电磁兼容和信号完整性分析。
  • 基金资助:
    国家自然科学基金(61271044,61427803)

Electromagnetic susceptibility analysis method for 3D TSV ICs

QIN Haichao, YAN Zhaowen, SU Donglin, ZHANG Wei   

  1. School of Electronic and Information Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100083, China
  • Received:2016-11-03 Revised:2016-12-16 Online:2017-12-20 Published:2017-04-07
  • Supported by:
    National Natural Science Foundation of China (61271044, 61427803)

摘要: 研究了三维集成电路(3D ICs)中硅通孔(TSV)的建模方法及三维集成电路电源分配网络(PDN)的建模方法,并结合印制电路板(PCB)的电源分布网络和芯片PDN模型,提出了一种对板级三维集成电路进行电源网络上电磁敏感性(EMS)的建模和协同分析方法。首先给出了地-信号(GS)结构和地-信号1-信号2-地(GSSG)结构TSV的电路模型,电路模型与数值仿真结果做了对比,验证了TSV电路建模方法的准确性。接着对PCB板级三维集成电路中PCB的电源分布网络,PCB过孔,集成电路封装参数进行建模。最后创建了一个PCB-三维集成电路电磁敏感性级联分析模型,使用该模型来研究三维集成电路对电源干扰的敏感特性,并由此指导三维集成电路的敏感性分析。

关键词: 硅通孔(TSV), TSV电路模型, 电源分配网络(PDN), 电磁敏感性(EMS), 印制电路板(PCB)

Abstract: This paper focuses on the circuit modeling method of through silicon via (TSV) and power distribution network (PDN) in 3D integrated circuits (3D ICs). Combined with the PDN on printed circuit board (PCB) and the chip PDN model, an electromagnetic susceptibility (EMS) modeling and collaborative analysis method for 3D ICs on PCB was proposed. Firstly, a ground-signal (GS) TSV pair and two TSV pairs of ground-signal1-signal2-ground (GSSG) were established in, and these circuit models were compared with the numerical simulation results, which validated the accuracy of the circuit modeling method of TSV. Then, the modeling method of PDN of PCB, PCB through via hole, IC's package parameters in an IC were discussed. Finally, an EMS cascade connection analysis model from PCB to 3D ICs was developed and used to analyze the electromagnetic susceptibility characteristics of 3D ICs to power interference, which can guide the susceptibility analysis of 3D ICs.

Key words: through silicon via (TSV), circuit model of TSV, power distribution network (PDN), electromagnetic susceptibility (EMS), printed circuit board (PCB)

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