基于XFEM-CZM耦合法的胶接接头裂纹扩展分析及强度预测

周伟; 张超; 甘淑媛

doi:10.13700/j.bh.1001-5965.2019.0579

基于XFEM-CZM耦合法的胶接接头裂纹扩展分析及强度预测

doi: 10.13700/j.bh.1001-5965.2019.0579

江苏大学机械工程学院, 镇江 212013

基金项目:

江苏省自然科学基金 BK20180855

中国博士后科学基金 2018M640459

机械结构力学及控制国家重点实验室开放课题（南京航空航天大学） MCMS-E-0219Y01

详细信息

作者简介:
周伟男, 硕士研究生。主要研究方向:复合材料损伤与断裂

张超 , 男, 博士, 副教授, 硕士生导师。主要研究方向:复合材料结构力学

通讯作者:
张超, E-mail: zhangchao@ujs.edu.cn

中图分类号: V258.3;TB332
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出版历程
- 收稿日期: 2019-11-11
- 录用日期: 2019-12-06
- 网络出版日期: 2020-11-20

Crack propagation analysis and strength prediction of bonded joints based on XFEM-CZM coupling method

School of Mechanical Engineering, Jiangsu University, Zhenjiang 212013, China

Funds:

Natural Science Foundation of Jiangsu Province BK20180855

China Postdoctoral Science Foundation 2018M640459

Research Fund of State Key Laboratory of Mechanics and Control of Mechanical Structures (Nanjing University of Aeronautics and Astronautics) MCMS-E-0219Y01

More Information

Corresponding author: ZHANG Chao, E-mail: zhangchao@ujs.edu.cn

摘要

摘要:
采用扩展有限元法（XFEM）和内聚力模型（CZM）相耦合的方法，分析胶接接头胶层内部裂纹扩展、界面脱粘分层现象。采用内聚力单元和内聚力接触描述胶层/板材界面，建立单/双搭接接头有限元模型。预测拉伸载荷下接头的强度性能并与已有试验数据对比分析，验证XFEM-CZM耦合法的可行性及内聚力单元和内聚力接触2种界面建模方法的有效性。模拟裂纹从胶层内部扩展至胶层/板材界面并引起界面脱粘分层的过程，分析其损伤失效机理。讨论初始裂纹长度和界面刚度、强度及应变能释放率对胶接接头强度性能的影响。结果表明：胶接接头强度随初始裂纹长度增加而降低，且在双搭接接头模型中表现更为明显；界面刚度、强度对胶接接头强度影响较大而应变能释放率的影响较小。
- 胶接接头 /
- 扩展有限元法(XFEM) /
- 内聚力模型(CZM) /
- 裂纹 /
- 界面脱粘
Abstract:
In this paper, the crack propagation and interface debonding in the adhesive layer of bonded joints were analyzed based on the coupling method of Extended Finite Element Method (XFEM) and Cohesive Zone Model (CZM). By using the cohesive interfacial element and surface-based cohesive contact to describe the interface between adhesive layer and adherent, the finite element models of single- and double-lap joints were established. The strength properties of bonded joints under tensile loading were predicted and compared with available experiment data. The feasibility of XFEM-CZM coupling method and the effectiveness of cohesive element and cohesive contact interfacial modeling methods were verified. The process of crack propagation from the interior of the adhesive layer to the adhesive layer/adherent interface was simulated, and the damage and failure mechanism in this process was analyzed. The effects of initial crack length, interface stiffness, strength and strain energy release rate on the strength properties of bonded joints were discussed. The numerical results show that the strength of bonded joints decreases with the increase of initial crack length, and it is more obvious in the double-lap joint model. The interface stiffness and strength have greater influence on the strength of bonded joints while the effect of strain energy release rate is small.
- bonded joints /
- Extended Finite Element Method (XFEM) /
- Cohesive Zone Model (CZM) /
- crack /
- interface debonding

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图 1 界面双线性Traction-Separation本构

Figure 1. Bilinear Traction-Separation model of interface

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图 2 单/双搭接接头几何模型

Figure 2. Geometrical models of single- and double-lap joints

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图 3 XFEM/内聚力单元耦合有限元模型

Figure 3. Finite element model using XFEM/cohesive element coupling method

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图 4 搭接接头的载荷-位移曲线

Figure 4. Load-displacement curves of lap joints

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图 5 裂纹在胶层中的起始、扩展过程

Figure 5. Crack initiation and propagation process in adhesive layer

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图 6 2种不同界面建模方法的界面分层情况对比

Figure 6. Comparison of interface debonding between two interface modeling methods

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图 7 搭接接头载荷-位移曲线随裂纹长度的变化

Figure 7. Variation of load-displacement curves with crack length for lap joints

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图 8 搭接接头载荷-位移曲线随界面刚度的变化

Figure 8. Variation of load-displacement curves with interface stiffness for lap joints

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图 9 搭接接头载荷-位移曲线随界面强度的变化

Figure 9. Variation of load-displacement curves with interface strength for lap joints

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表 1 AW6082/T651和AV138材料参数^[19]

Table 1. Material parameters of AW6082/T651 and AV138^[19]

参数	AW6082/T651	AV138
E/MPa	70 070	4 890
ν	0.33	0.35
δ_f/MPa	324	39.45
τ_f/MPa		30.2
G_ⅠC/(N·mm^-1)		0.2
G_ⅡC/(N·mm^-1)		0.38
注:E—弹性模量; ν—泊松比; δ_f—法向强度; τ_f—剪切强度。

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表 2 界面性能参数

Table 2. Parameters of interface properties

参数	数值
K/(N·mm^-3)	1×10⁶
N/MPa	39.45
S=T/MPa	30.2
G_ⅠC/(mJ·mm^-2)	0.2
G_ⅡC=G_ⅢC/(mJ·mm^-2)	0.38

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表 3 网格数量对单搭接接头最大载荷-位移预测结果的影响

Table 3. Influence of element number on predicted maximum load-displacement results of single-lap joint

网格数量	最大载荷/N	位移/mm
750	5 602.63	0.201
1 500	5 544.73	0.193
3 000	5 543.71	0.192
6 000	5 407.28	0.190

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表 4 单搭接模型最大载荷-位移数据与试验数据对比

Table 4. Comparison of maximum load-displacement result and test result for single-lap joint model

数据及相对误差		最大载荷/N	位移/mm
试验数据		5 500.2	0.205
仿真数据	内聚力单元	5 535	0.190
仿真数据	内聚力接触	5 551	0.178
相对误差/%	内聚力单元	0.6	7.3
相对误差/%	内聚力接触	0.9	17.0

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