泡沫铜/低熔点合金复合相变材料凝固放热分析

侯天睿; 邢玉明; 郑文远; 郝兆龙

doi:10.13700/j.bh.1001-5965.2020.0553

泡沫铜/低熔点合金复合相变材料凝固放热分析

doi: 10.13700/j.bh.1001-5965.2020.0553

1.
北京航空航天大学航空科学与工程学院, 北京 100083
2.
航空机电系统综合航空科技重点实验室，南京 211106

基金项目:

航空科学基金 20172851018

详细信息

通讯作者:
郝兆龙, E-mail: haozhaolong@buaa.edu.cn

中图分类号: TQ051.5;TK124
计量
- 文章访问数: 530
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- 被引次数: 0
出版历程
- 收稿日期: 2020-09-27
- 录用日期: 2020-11-01
- 网络出版日期: 2022-03-20

Solidification heat release of copper foam/low-melting-point alloy composite phase change material

1.
School of Aeronautic Science and Engineering, Beihang University, Beijing 100083, China
2.
Aviation Electromechanical System Comprehensive Aviation Technology Key Laboratory, Nanjing 211106, China

Funds:

Aeronautical Science Foundation of China 20172851018

More Information

Corresponding author: HAO Zhaolong, E-mail: haozhaolong@buaa.edu.cn

摘要

摘要:
为研究泡沫铜/低熔点合金(LMPA)复合相变材料在间歇放热工作环境下恢复至初始状态的能力及不同孔隙率泡沫铜的添加对其凝固放热过程的影响，通过数值模拟对比分析了47合金、正二十三烷与泡沫铜复合前后的凝固放热过程，并调节泡沫铜/47合金复合材料孔隙率计算模拟芯片温度在凝固放热过程中温度随时间变化曲线。结果表明：泡沫铜的添加对2类材料凝固过程均有促进作用，模拟芯片恢复至目标温度所需时间分别被缩短6.6%和47.7%。因体积潜热值的差距，泡沫铜/47合金凝固时需放出更多热量，恢复至目标温度的时间较长，是正二十三烷复合相变材料的1.52倍。随着孔隙率的增大，复合相变材料恢复至室温状态所用时长变化不大，考虑到孔隙率对相变热控过程中的影响，实际使用时应综合考虑。
- 低熔点合金(LMPA)复合材料 /
- 数值模拟 /
- 间歇性 /
- 凝固放热 /
- 孔隙率
Abstract:
In order to research the competence of the copper foam/low-melting-point alloy (LMPA) composite material to recover to the initial state in the intermittent exothermic working environment and the influence of the addition of copper foam with different porosity on the solidification exothermic process, this paper compares and analyzes the solidification exothermic process of 47 alloys and n-tricosane before and after compositing with copper foam through numerical simulation, and adjusts the porosity of the copper foam/47 alloy composite material to calculate the temperature change curve of the simulation chip temperature during the solidification exothermic process. The results show that the addition of copper foam can promote the solidification process of the two types of materials, and the time of the simulation chip to recover to the target temperature is shortened by 6.6% and 47.7%. Due to the difference in volume latent heat value, the copper foam/47 alloy needs to release more heat during solidification, and it takes longer to recover to the target temperature, which is 1.52 times that of the n-tricosane composite. With the increase of porosity, the time that is taken for the composite phase change material to return to room temperature does not change much. Considering the influence of porosity on the thermal control process of phase change, comprehensive consideration should be given to actual use.
- low-melting-point alloy (LMPA) composite /
- numerical simulation /
- intermittent /
- solidification heat release /
- porosity

HTML全文

图 1 相变热控装置示意图

Figure 1. Schematic diagram of phase change thermal control device

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图 2 网格数量无关性验证

Figure 2. Verification of independence of number of grids

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图 3 时间步长无关性验证

Figure 3. Verification of independence of time step length

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图 4 计算网格划分

Figure 4. Computing grid generation

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图 5 网格质量

Figure 5. Grid quality

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图 6 实验结果与数值模拟对比^[7]

Figure 6. Comparison of experimental results and numerical simulation^[7]

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图 7 四种材料温度随时间变化曲线

Figure 7. Change of temperature of four materials with time

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图 8 泡沫铜/正二十三烷凝固过程温度场云图

Figure 8. Temperature field contour of copper foam/n-tricosane solidification process

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图 9 泡沫铜/47合金凝固过程温度场云图

Figure 9. Temperature field contour of copper foam/47 alloy solidification process

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图 10 泡沫铜/正二十三烷凝固过程速度场云图

Figure 10. Velocity field contour of copper foam/n-tricosane solidification process

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图 11 泡沫铜/47合金凝固过程速度场云图

Figure 11. Velocity field contour of copper foam/47 alloy solidification process

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图 12 不同孔隙率泡沫铜/47合金凝固放热过程温度曲线

Figure 12. Temperature curves of solidification exothermic process of copper foam/47 alloy with different porosity

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表 1 材料物性参数

Table 1. Material's physical property parameters

物性参数	47合金	正二十三烷	泡沫铜	316L不锈钢
相变温度/℃	51	47.6
潜热值/(kJ·kg^-1)	32.4	234.4
密度/(kg·m^-3)	9 160	797	8 978	8 030
比热容/(J·(kg·K)^-1)	160	2 360	381	502.5
导热系数/(W·(m·K)^-1)	11.7	0.21	387.6	16.27
黏度/(Pa·S)	1.1	0.014 8
热膨胀率/ T^-1	2.44×10^-5	9×10^-4

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