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�������պ����ѧѧ�� 2005, Vol. 31 Issue (08) :921-924    DOI:
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Research of ventilation cooling profile in reliability testing
Wang Xiaohong, Jiang Tongmin*
Dept. of System Engineering of Engineering Technology, Beijing University of Aeronautics and Astronautics, Beijing 100083, China

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Abstract�� The applying of the ventilation stress in the reliability test of the airborne electronic equipment were introduced. Combined with the GJB and the characteristic of the environment control system of airplane, the ventilation and cooling condition of airborne electronic equipments in factual use environment was investigated;Combined with the life profile, task profile and its environment condition, flight altitude, flight mach number, etc, the stress in reliability test and the problems in those standards in use present were investigated. The simulation of the ventilation and cooling conditions of factual environment was introduced. A ventilation and cooling profile with reason in reliability testing (including the conforming method of parameters of ventilate air—such as flux, temperature, humidity and cleanness etc) was established. Through research of a product with these items, the ventilation cooling profile (including the parameters of ventilate air and infliction time )which was compatible with the temperature profile was given.
Keywords�� reliability testing   ventilation   profile   flight altitude   mach number   electronic equipment     
Received 2004-03-30;
About author: ������(1969-),Ů,���ɹŰ�ͷ��,��ʦ, zwr0612@sohu.com.
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������, ��ͬ��.�ɿ���������ͨ����ȴ�����̽��[J]  �������պ����ѧѧ��, 2005,V31(08): 921-924
Wang Xiaohong, Jiang Tongmin.Research of ventilation cooling profile in reliability testing[J]  JOURNAL OF BEIJING UNIVERSITY OF AERONAUTICS AND A, 2005,V31(08): 921-924
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