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�������պ����ѧѧ�� 2004, Vol. 30 Issue (02) :173-176    DOI:
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Discussion about seal test of electronics in GJB
Zhang Dandan, Wu Jianwen*
School of Automation Science and Electrical Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100083, China

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Abstract�� The problems about sealing test of electronics in GJB were analyzed. Improved methods were presented, which provide the references for controlling theseal quality of military products scientifically. Failure data from a seal test processed by some factory are given to illustrate the importance of strictly controlling test conditions.
Keywords�� sealing   reliability   leak rate   fine leak   GJB     
Received 2002-10-16;
About author: �ŵ���(1979-),Ů,�㶫��ͷ��,˶ʿ��, dandanzdd@tom.com.
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�ŵ���, �佨��.���ڹ��������Ԫ�����ܷ��������̽��[J]  �������պ����ѧѧ��, 2004,V30(02): 173-176
Zhang Dandan, Wu Jianwen.Discussion about seal test of electronics in GJB[J]  JOURNAL OF BEIJING UNIVERSITY OF AERONAUTICS AND A, 2004,V30(02): 173-176
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http://bhxb.buaa.edu.cn//CN/     ��     http://bhxb.buaa.edu.cn//CN/Y2004/V30/I02/173
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