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�������պ����ѧѧ�� 2004, Vol. 30 Issue (10) :930-933    DOI:
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����Ti/Ag/Ti�м������SiC�մɵ� ����ԪӦ������
ë����1, �Ž���2, ������1*
1. �������պ����ѧ ���Ͽ�ѧ�빤��ѧԺ ���� 100083;
2. ����ʯ�ͻ���ѧԺ ��е����ѧԺ ���� 102617
Analysis of the residual thermal stresses of SiC joint with Ti/Ag/Ti interlayer by FEM
Mao Yangwu1, Zhang Jianjun2 ,Li Shujie1*
1. School of Materials Science and Engineering, Beijing University of Aeronautics and Astronautics�� Beijing 100083, China;
2. Department of Mechanical Engineering, Beijing Institute of Petrochemical Technology, Beijing 102617, China

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Abstract�� With regard to the joining of ceramic to ceramic using metallic interlayers or the joining of ceramic to metal, the mismatch of thermal expansion coefficient between the ceramic and the metallic materials generates residual thermal stresses during joining and cooling. The stresses may cause microcracks leading to low weld strength and even failure of joining. The residual thermal stresses of SiC joint with Ti/Ag/Ti interlayer were analysized by finite element method(FEM). The results indicate that the residual thermal stresses mainly distribute in the area near the welding seam. The area close to the outer surface and near the welding seam is the weakest area of the joint, where cracks are likely to be initiated. The fracture position of the joint indicated by the FEM analysis is in accordance with the result of experiment.
Keywords�� finite element analysis   stress analysis   joining of ceramics     
Received 2004-04-28;
Fund:

������Ȼ��ѧ����������Ŀ(50271003); ���ջ�����ѧ����������Ŀ(03H51024)

About author: ë����(1978-),��,�����ֳ���,��ʿ��, yangwu1978@163.com.
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ë����, �Ž���, ������.����Ti/Ag/Ti�м������SiC�մɵ� ����ԪӦ������[J]  �������պ����ѧѧ��, 2004,V30(10): 930-933
Mao Yangwu, Zhang Jianjun ,Li Shujie.Analysis of the residual thermal stresses of SiC joint with Ti/Ag/Ti interlayer by FEM[J]  JOURNAL OF BEIJING UNIVERSITY OF AERONAUTICS AND A, 2004,V30(10): 930-933
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http://bhxb.buaa.edu.cn//CN/     ��     http://bhxb.buaa.edu.cn//CN/Y2004/V30/I10/930
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