Application research on thermal analysis software of electronic systems
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摘要: 应用热分析技术,能在产品的设计阶段获得其温度分布,从而优化设计,提高产品可靠性.介绍了现在流行的电子设备热分析软件,阐述了电子设备热分析软件在应用中面临的一些问题,并结合一简单实例,展示了电子设备热分析的全过程,对热分析软件应用中的部分难题提出了解决方案.结果表明:妥善处理好主要问题,则能够达到较高的热分析精度,满足工程需求.Abstract: The temperature field of a product can be picked up to optimize the design and improve the reliability by the technology of thermal analysis in the phase of design. Based on the characters of thermal analysis software, some problems in their application are discussed. With a simple example, the whole process of thermal analysis is presented, and several application solutions are given. The results show that if the main problems are solved correctly, a good thermal analysis will be gained to meet the demands of engineering.
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