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金合金锡铅软钎焊接头脆性行为

尹娜 曲文卿 杨淑娟 李睿

尹娜, 曲文卿, 杨淑娟, 等 . 金合金锡铅软钎焊接头脆性行为[J]. 北京航空航天大学学报, 2013, 39(5): 670-673.
引用本文: 尹娜, 曲文卿, 杨淑娟, 等 . 金合金锡铅软钎焊接头脆性行为[J]. 北京航空航天大学学报, 2013, 39(5): 670-673.
Yin Na, Qu Wenqing, Yang Shujuan, et al. Brittle behavior of gold alloy joint soldered with tin-lead solder[J]. Journal of Beijing University of Aeronautics and Astronautics, 2013, 39(5): 670-673. (in Chinese)
Citation: Yin Na, Qu Wenqing, Yang Shujuan, et al. Brittle behavior of gold alloy joint soldered with tin-lead solder[J]. Journal of Beijing University of Aeronautics and Astronautics, 2013, 39(5): 670-673. (in Chinese)

金合金锡铅软钎焊接头脆性行为

详细信息
  • 中图分类号: V252.3

Brittle behavior of gold alloy joint soldered with tin-lead solder

  • 摘要: 采用Sn63Pb37钎料对Au60AgCu合金进行钎焊试验.对钎焊接头的微观组织、显微硬度、化合物相成分、力学性能及断口形貌进行了分析,并探讨了界面化合物相对接头脆性的影响.结果表明:Au60AgCu合金接头化合物主要由AuSn2,AuSn4和Ag3Sn组成.金属间化合物的硬度很高,其厚度随钎焊温度的升高及保温时间的增长而增厚.钎焊接头剪切性能测试表明,断裂发生在金属间化合物层,断口形貌为脆性断裂.

     

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  • 被引次数: 0
出版历程
  • 收稿日期:  2012-05-29
  • 修回日期:  2012-06-29
  • 网络出版日期:  2013-05-31

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