北京航空航天大学学报 ›› 2019, Vol. 45 ›› Issue (3): 478-485.doi: 10.13700/j.bh.1001-5965.2018.0401

• 论文 • 上一篇    下一篇

循环电载荷下大功率LED金引线疲劳断裂寿命预测

樊嘉杰1,2, 李磊2, 钱诚3, 胡爱华4, 樊学军5, 张国旗6   

  1. 1. 河海大学 机电工程学院, 常州 213022;
    2. 常州市武进区半导体照明应用技术研究院, 常州 213161;
    3. 北京航空航天大学 可靠性与系统工程学院, 北京 100083;
    4. 福建鸿博光电科技有限公司, 福州 350008;
    5. 美国拉玛尔大学 机械工程系, 博蒙特 77710;
    6. 荷兰代尔夫特理工大学 EEMCS学院, 代尔夫特 2628
  • 收稿日期:2018-07-02 出版日期:2019-03-20 发布日期:2019-04-04
  • 通讯作者: 樊嘉杰,E-mail:jiajie.fan@hhu.edu.cn E-mail:jiajie.fan@hhu.edu.cn
  • 作者简介:樊嘉杰,男,博士,副教授,硕士生导师。主要研究方向:机械电子器件及系统故障诊断和预测、半导体照明系统可靠性评估、第三代半导体封装及组装工艺等。
  • 基金资助:
    国家自然科学基金(51805147,61673037);江苏省"六大人才高峰"高层次人才项目(GDZB-017);中央高校基本科研业务费专项资金(2017B15014);国家国际科技合作专项(2015DFT10110)

Fatigue fracture lifetime prediction for gold bonding wires of high-power LED under cyclically electrical loading

FAN Jiajie1,2, LI Lei2, QIAN Cheng3, HU Aihua4, FAN Xuejun5, ZHANG Guoqi6   

  1. 1. College of Mechanical and Electrical Engineering, Hohai University, Changzhou 213022;
    2. Changzhou Institute of Technology Research for Solid State Lighting, Changzhou 213161, China;
    3. School of Reliability and Systems Engineering, Beihang University, Beijing 100083, China;
    4. Fujian Hongbo Opto-Electronics Technology Co., Ltd., Fuzhou 350008, China;
    5. Department of Mechanical Engineering, Lamar University, Beaumont 77710, USA;
    6. EEMCS Faculty, Delft University of Technology, Delft 2628, Netherlands
  • Received:2018-07-02 Online:2019-03-20 Published:2019-04-04

摘要: 随着大功率发光二极管(LED)在照明领域的普及与广泛应用,可靠性逐渐成为研究的重点。大功率LED封装器件中金引线疲劳断裂失效一直是制约其可靠性的重要因素。通过针对大功率LED封装器件中的金引线力学仿真与功率循环试验相结合的方法,首先确定循环电载荷条件下该型LED的主要失效原因为金引线疲劳断裂,其次提出基于电流加速模型的加速因子提取方法和基于应变幅值的Coffin-Manson解析寿命预测方法,最终完成对LED金引线疲劳断裂寿命的预测和试验验证。研究结果表明:所提方法具有较高的寿命预测精度,可以满足大功率LED封装器件可靠性快速、准确评估的要求。

关键词: 大功率发光二极管(LED), 金引线, 疲劳断裂, 寿命预测, 可靠性

Abstract: With the popularity and widespread application of high-power light-emitting diode (LED) in lighting industry, its reliability has gradually become one of research focuses.The failure of gold bonding wires in the traditional LED package has been a critical bottleneck that restricts its reliability. In this paper, the failure mechanism of LED under cyclically electrical loading is firstly identified through both gold bonding wire mechanical simulation and power cycling test experiment, which is the fatigue fracture of gold bonding wire. Then, two lifetime prediction methods, the acceleration factor extraction method based on current acceleration model and the strain-based Coffin-Manson analytical method, are established and verified with experimental results. The results show that the lifetime prediction accuracy of the proposed methods is high and they can achieve a fast and accurate reliability assessment for high-power LEDs with wire-bonding packaging technology.

Key words: high-power light-emitting diode (LED), gold bonding wires, fatigue fracture, lifetime prediction, reliability

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