PBGA封装芯片热环境适应性仿真分析

李永强; 吕卫民

doi:10.13700/j.bh.1001-5965.2020.0339

PBGA封装芯片热环境适应性仿真分析

doi: 10.13700/j.bh.1001-5965.2020.0339

李永强,
吕卫民^,

海军航空大学岸防兵学院, 烟台 264001

基金项目:

国家自然科学基金 51975580

详细信息

通讯作者:
吕卫民, E-mail: lyq281214@foxmail.com

中图分类号: TJ760.6
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- 被引次数: 0
出版历程
- 收稿日期: 2020-07-13
- 录用日期: 2020-10-30
- 网络出版日期: 2021-09-20

Simulation analysis of PBGA packaged chips' thermal environment adaptability

LI Yongqiang,
LYU Weimin^,

Coast Guard College, Naval Aeronautical University, Yantai 264001, China

Funds:

National Natural Science Foundation of China 51975580

More Information

Corresponding author: LYU Weimin, E-mail: lyq281214@foxmail.com

摘要

摘要:
针对多数塑料焊球阵列（PBGA）封装芯片仅依据美军MIL标准进行高低温交变测试致使预测服役寿命偏差较大的情况，将微控制芯片任务状态时间谱转化为环境温度载荷谱，在综合考虑热传导、热对流的情形下，利用icepak完成芯片热电耦合仿真分析，并借助于Transient Thermal及Transient Structural完成芯片结温的获取及焊点应力、应变的计算求解。同时，依据Arrhenius模型及修正Coffin-Manson热疲劳模型分别预测芯片本身及焊点的寿命，从而实现对其热环境适应能力的定量分析。仿真结果表明：芯片的预测寿命约为6.26年，寿命预测偏差约为13.4%，符合GJB 4239-2001中单个关键环境因素预测寿命偏差标准，能够较为精确地反映其热环境适应性。
- 塑料焊球阵列(PBGA)封装 /
- 芯片焊点 /
- 任务时间谱 /
- 热疲劳 /
- 环境适应性
Abstract:
In view of the fact that most Plastic Ball Grid Array (PBGA) packaged chips are only subjected to high and low temperature alternating tests in accordance with the US military MIL standard, resulting in a large deviation in predicted service life, this paper converts the microcomputer control chip mission time spectrum into ambient temperature parameters, and comprehensively considers the heat conduction and heat convection, so as to use icepak to complete the chip thermoelectric coupling simulation analysis, and use Transient Thermal and Transient Structural to complete the chip junction temperature acquisition and solder joint stress and strain calculation and solution. At the same time, the life of chip itself and the solder joint are predicted based on the Arrhenius model and the modified Coffin-Manson thermal fatigue model, so as to realize the quantitative analysis of its thermal environment adaptability. The simulation results show that the predicted life of the chip is about 6.26 years, and the life prediction deviation is about 13.4%, which complies with GJB 4239's single key environmental factor predicted life deviation standard and accurately reflects its thermal environment adaptability.
- Plastic Ball Grid Array (PBGA) package /
- chip solder joints /
- task time spectrum /
- thermal fatigue /
- environmental adaptability

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图 1 芯片有限元模型

Figure 1. Chip finite element model

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图 2 焊点有限元模型

Figure 2. Finite element model of solder joint

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图 3 温度载荷

Figure 3. Temperature load

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图 4 芯片温度分布

Figure 4. Chip temperature distribution

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图 5 芯片应变示意图

Figure 5. Schematic diagram of chip deformation

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图 6 焊点等效塑性应变示意图

Figure 6. Schematic diagram of equivalent plastic strain of solder joint

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图 7 芯片温度曲线

Figure 7. Chip junction temperature curve

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图 8 温度加速倍率曲线

Figure 8. Temperature acceleration rate curve

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图 9 焊点等效塑性应变曲线

Figure 9. Solder joint equivalent plastic strain curve

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图 10 焊点等效应力曲线

Figure 10. Solder joint equivalent stress curve

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图 11 实际使用寿命数据

Figure 11. Actual service life data

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表 1 芯片组成部分结构尺寸

Table 1. Chip component structure size

芯片结构	长度l/mm	宽度b/mm	厚度δ /mm
硅晶片	14	14	0.3
BT基板	27	27	0.15
黏结层	14	14	0.10
PCB板	30	30	1.0

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表 2 材料热特性参数

Table 2. Thermal property parameters of material

零部件	材料	密度/ (kg·m^-3)	比热容/ (J·(kg·K)^-1)	热导率/ (W·(m·K)^-1)	弹性模量/ MPa	泊松比	热膨胀系数/ K^-1
裸芯片	Si	2 330	26+1.99T	180	162 716	0.28	1.3×10^－5
黏结层	环氧树脂	3 500	700	1.5	17 944－37.5T	0.35	*
基板	聚酰亚胺	1 700	880	0.33	24 132	0.30	1.6×10^－5
镀通孔	Cu	8 933	142+0.68T	387.6	128 932	0.34	1.7×10^－5
PCB板	FR-4	1 900	750	0.2	22 000	0.28	1.9×10^－5
塑封	模塑树脂	1 900	800	0.7	68 220－150T	0.25	*
焊点	63Sn37Pb	8 470	150	51	75 842－152T	0.35	2.45×10^－5
注：“*”表示此处数值见表 3。

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表 3 非线性热膨胀系数

Table 3. Nonlinear thermal expansion coefficient

温度/K	233	298	403	418	423	428
塑封热膨胀系数/K^-1	9.0×10^-6	0	10^-5	1.7×10^-5	2.2×10^-5	2.7×10^-5

温度/K	233	298	353	363	368	373
黏结层热膨胀系数/K^-1	4.4×10^-5	0	4.5×10^-5	7.9×10^-5	8.9×10^-5	9.9×10^-5

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表 4 本构模型相关参数

Table 4. Relevant parameters of constitutive model

参数	数值
初始形变阻抗s₀/MPa	56.33
激活能Q/(J·mol^-1)	10 830
指数前系数因子A	1.49×10⁷
应力因子ξ	11
应变硬化常数h₀/MPa	2 640.75
应变率敏感指数m	0.303
形变阻抗饱和值系数/MPa	80.415
应变率敏感度n	0.023 1
应变硬化指数α	1.34

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表 5 加速退化试验样本数据

Table 5. Sample data of accelerated degradation test

样品序号	加速退化试验时间/h	退化量/%	预测寿命/h
1#	200	0.55	7 270.7
2#	200	0.58	6 896.6
3#	200	0.60	6 666.7
4#	300	0.83	7 228.9
5#	300	0.87	6 896.6
6#	300	0.80	7 500.0
7#	400	1.10	7 272.7
8#	400	1.09	7 339.4
9#	400	1.16	6 896.6
10#	500	1.40	7 142.9
11#	500	1.46	6 849.3
12#	500	1.48	6 756.8
13#	600	1.70	7 058.9
14#	600	1.73	6 936.4
15#	600	1.71	7 017.5

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