[an error occurred while processing this directive]
���¿��ټ��� �߼�����
   ��ҳ  �ڿ�����  ��ί��  Ͷ��ָ��  �ڿ�����  ��������  �� �� ��  ��ϵ����
�������պ����ѧѧ�� 2009, Vol. 35 Issue (9) :1134-1138    DOI:
���� ����Ŀ¼ | ����Ŀ¼ | ������� | �߼����� << | >>
�����, �� ��, �Ž���, �ѱ��*
�������պ����ѧ ���տ�ѧ�빤��ѧԺ, ���� 100191
Randomization analysis of the thermal-mechanical crack growth
Yang Hongqin, Bao Rui, Zhang Jianyu, Fei Binjun*
School of Aeronautic Science and Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100191, China

Download: PDF (385KB)   HTML 1KB   Export: BibTeX or EndNote (RIS)      Supporting Info
ժҪ Ϊ�����¶�/��е�غɹ�ͬ������������չ����,����ƣ�ͺ����������չ�����Ե���ģ��,�����˽���������������.�÷���������������ȡ�µIJ��ϲ���,�����ԭģ�������ڽ����غɶ����������չ��Ӱ�������µIJ��ϲ���������������.�ڴ�����ģ�ͻ�����,���������̬�������,�������¶�/��е�غɹ�ͬ�����µ�������չ���ģ��,������̩�ռ���չ���������ָ�����Ƴ����������ֲ���ָ�����������Ƴ��ȷֲ��ı��ʽ.ͨ�������Ƚ����ģ�ͺ���������õ������ֲ�,֤ʵ�˸�������������Ŀɿ���.
Email Alert
�ؼ����� ������չ   �¶�/��е�غ�   ����ģ��   ���������     
Abstract�� In order to describe the crack growth law under thermal-mechanical loading, the linear superposition model of fatigue and creep crack growth was amended based on the experimental results. New material parameters in the model were determined, as the original ones may not be independent of the stress ratio, temperature and dwell time due to the influence of alternating load to the creep crack propagation. Then, a random crack growth model was obtained by introducing lognormal random process to the amended model. With the Taylor series expansion, the distribution of the crack size at any service time and the distribution of the service time to reach any crack size were attained. An example was given to validate the reliability of the proposed randomization method by comparing the life distribution obtained from the model with the experiment.
Keywords�� crack propagation   thermal/mechanical   superposition model   randomization method     
Received 2008-09-19;
About author: ����� (1982-),Ů,�����γ���,��ʿ��,yanghongqin@ase.buaa.edu.cn.
�����, �� ��, �Ž���, �ѱ��.�¶�/��е�غ�������������չ�����������[J]  �������պ����ѧѧ��, 2009,V35(9): 1134-1138
Yang Hongqin, Bao Rui, Zhang Jianyu, Fei Binjun.Randomization analysis of the thermal-mechanical crack growth[J]  JOURNAL OF BEIJING UNIVERSITY OF AERONAUTICS AND A, 2009,V35(9): 1134-1138
http://bhxb.buaa.edu.cn//CN/     ��     http://bhxb.buaa.edu.cn//CN/Y2009/V35/I9/1134
Copyright 2010 by �������պ����ѧѧ��