北京航空航天大学学报 ›› 2009, Vol. 35 ›› Issue (6): 775-778.

• 论文 • 上一篇    下一篇

蜂窝夹芯板缺陷的ESSPI无损检测

栾 旭, 梁 军, 程 靳, 王 超   

  1. 哈尔滨工业大学 航天学院, 哈尔滨 150001
  • 收稿日期:2008-12-11 出版日期:2009-06-30 发布日期:2010-09-16
  • 作者简介:栾 旭(1981-),男,吉林长春人,博士生,luanpt78@163.com.
  • 基金资助:

    国家高技术研究发展计划资助项目(2007AA702408)

ESSPI non-destructive testing of honeycomb sandwich panel for bonding defects

Luan Xu, Liang Jun, Cheng Jin, Wang Chao   

  1. School of Astronautics, Harbin Institute of Technology, Harbin 150001, China
  • Received:2008-12-11 Online:2009-06-30 Published:2010-09-16

摘要: 蜂窝夹芯板的缺陷严重地制约和影响了其在航空航天领域的应用.介绍了电子剪切散斑干涉技术的基本原理,并利用电子剪切散斑干涉技术,用热加载的方式对蜂窝夹芯板进行了无损检测,通过图像处理及对含缺陷材料的3点弯曲实验,验证了电子剪切散斑干涉技术的正确性和适用性.结果表明,蒙皮与蜂窝芯子的脱粘等缺陷是蜂窝夹芯板强度降低的主要原因,该无损检测技术可以快速地对蜂窝夹芯板的质量检测进行评估.

Abstract: Bonding defects of the honeycomb sandwich panel reduced its strength greatly, thus the application in aeronautics and astronavigation was influenced seriously. The basic principles of electronic speckle shearing pattern interferometry (ESSPI) were introduced. Using ESSPI technique and thermal loading method, non-destructive testing to honeycomb sandwich panels was conducted, then image processing was carried through compiled program. The validity and practicability of ESSPI technique was proved through the three-point bending experiment. The results show that the main reason of strength decrease is the defects of facesheet and honeycomb core debonding, and the ESSPI is very effective evaluation technique to the honeycomb sandwich panel quality.

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