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Relationship between PCB material and power/ground impedance
Su Donglin, Wang Xiaoxiao*
School of Electronics and Information Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100083, China

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Abstract�� To mitigate PCB(printed circuit board) power/ground impedance, which is a great negative influential factor to signal and power integrity of high-speed multilayer PCB , the relation functions among PCB power/ground resonant impedance,resonant frequency, resonant quality factor and the electromagnetic parameters of power/ground planes structure were deducted based on cavity resonant model. According to the deductions above, two main ways to reduce PCB power/ground resonant impedance from the aspect of selecting conductive and insulating materials whose electromagnetic parameters are more helpful to reduce power/ground impedance were developed. These two ways include using conductive material with high permeability and low conductivity and adopting insulating material with high permittivity and loss tangent. The latter full-wave simulation results prove the effectiveness these two ways.
Keywords�� PCB   resonant impedance   power/ground parallel planes structure   parallel planes cavity resonant model   power integrity   simultaneous switching noise     
Received 2006-07-06;
About author: �ն���(1960-),Ů,������,����,sdl@buaa.edu.cn.
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�ն���, ������.PCB�������Դ/�ز�г���迹��ϵ[J]  �������պ����ѧѧ��, 2007,V33(05): 568-571
Su Donglin, Wang Xiaoxiao.Relationship between PCB material and power/ground impedance[J]  JOURNAL OF BEIJING UNIVERSITY OF AERONAUTICS AND A, 2007,V33(05): 568-571
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