[an error occurred while processing this directive]
���¿��ټ��� �߼�����
   ��ҳ  �ڿ�����  ��ί��  Ͷ��ָ��  �ڿ�����  ��������  �� �� ��  ��ϵ����
�������պ����ѧѧ�� 2007, Vol. 33 Issue (05) :568-571    DOI:
���� ����Ŀ¼ | ����Ŀ¼ | ������� | �߼����� << | >>
�ն���, ������*
�������պ����ѧ ������Ϣ����ѧԺ, ���� 100083
Relationship between PCB material and power/ground impedance
Su Donglin, Wang Xiaoxiao*
School of Electronics and Information Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100083, China

Download: PDF (347KB)   HTML 1KB   Export: BibTeX or EndNote (RIS)      Supporting Info
ժҪ Ϊ���Ͷ�����PCB(Printed Circuit Board)��Դ/��г���迹,����ƽ��ƽ��ǻ��г��ģ�������Ƶ���PCB��Դ/��г���迹��г��Ƶ�ʡ�г��Ʒ�������빹��PCB��ĵ�����Ϻ;�Ե���ϵĵ�Ų�����֮��ĺ�����ϵʽ,�����ݴ˹�ϵʽ�ó��˴�PCB����ѡȡ�Ƕȼ�С��Դ/��г���迹������;��,�����øߴŵ��ʡ��͵絼�ʵĵ�����ϴ�����ͨ�������;���ø߽�糣����������е�ƽ����Ե�����.���PCB��Դ/��ƽ��ƽ��ṹ��ȫ��������֤ʵ��������;������Ч��.
Email Alert
�ؼ����� PCB   г���迹   ��Դ/��ƽ��ƽ��ṹ   ƽ��ƽ��ǻ��г��ģ��   ��Դ������   ͬʱת������     
Abstract�� To mitigate PCB(printed circuit board) power/ground impedance, which is a great negative influential factor to signal and power integrity of high-speed multilayer PCB , the relation functions among PCB power/ground resonant impedance,resonant frequency, resonant quality factor and the electromagnetic parameters of power/ground planes structure were deducted based on cavity resonant model. According to the deductions above, two main ways to reduce PCB power/ground resonant impedance from the aspect of selecting conductive and insulating materials whose electromagnetic parameters are more helpful to reduce power/ground impedance were developed. These two ways include using conductive material with high permeability and low conductivity and adopting insulating material with high permittivity and loss tangent. The latter full-wave simulation results prove the effectiveness these two ways.
Keywords�� PCB   resonant impedance   power/ground parallel planes structure   parallel planes cavity resonant model   power integrity   simultaneous switching noise     
Received 2006-07-06;
About author: �ն���(1960-),Ů,������,����,sdl@buaa.edu.cn.
�ն���, ������.PCB�������Դ/�ز�г���迹��ϵ[J]  �������պ����ѧѧ��, 2007,V33(05): 568-571
Su Donglin, Wang Xiaoxiao.Relationship between PCB material and power/ground impedance[J]  JOURNAL OF BEIJING UNIVERSITY OF AERONAUTICS AND A, 2007,V33(05): 568-571
http://bhxb.buaa.edu.cn//CN/     ��     http://bhxb.buaa.edu.cn//CN/Y2007/V33/I05/568
Copyright 2010 by �������պ����ѧѧ��