Experiments on surface structure for micro assembly using adhesive bonding
Ma Weimin1, Jürgen Hesselbach2, Huan Ji1*
1. School of Mechanical Engineering and Automation, Beijing University of Aeronautics and Astronautics, Beijing 100083, China;
2. Institute of Machine Tools and Production Technology, TU Braunschweig, Braunschweig D38106, Germany
Micro adhesive bonding technology shows great potential in the assembly of micro-electro-mechanical system(MEMS) products. The quality of micro assembly using adhesive bonding is sensitive to two factors:the fluctuation of the adhesive volumes and the spread of the meniscus.In order to solve this problem, two surface structures on the bonding area were experimentally studied,which were the groove structure and meniscus-self-centering structure. Experiment results show that, the former structure has the ability of "fault-tolerance" to the volume of meniscus, and can overcome the influence of the mentioned factors on the quality of micro adhesive bonding; the latter structure enables meniscus to spread itself to the center of the groove, and thus to weaken the influence of the position error of micro assembly system. The two studied surface structures can be applied into the assembly of general MEMS products.