The metal copper and nickel film was deposited on particles by direct current magnetron sputtering method under different working conditions. The surface morphology, film thickness, chemical composition, film grain size as well as the film crystallization of particles were analyzed by optical microscope (OM), field emission scanning electron microscopy (FESEM), energy dispersive spectroscopy (EDS), multimode scanning probe microscope (SPM),inductively coupled plasma-atom emission spectrometer (ICP-AES), X-ray photoelectron spectroscopic (XPS) and X-ray diffraction (XRD) respectively before and after the plating process. The effects of different sputtering conditions on crystallization of metal films deposited on particles were discussed. The results indicate that the relatively uniform, compact and adhesive metal films were successfully deposited on particles through controlling the motion mode of particles during the sputter deposition. With the increasing of sputtering time or the increasing of sputtering power or the decreasing of the particle loading amount, both crystallization and grain size of metal film were improved.
Shen Zhigang, Yu Xiaozheng, Xu Zheng, Pei Xihua.Plating metal film on the surface of particles using magnetron sputtering method[J] JOURNAL OF BEIJING UNIVERSITY OF AERONAUTICS AND A, 2006,V32(10): 1193-1198