北京航空航天大学学报 ›› 2006, Vol. 32 ›› Issue (10): 1193-1198.

• 论文 • 上一篇    下一篇

微颗粒表面磁控溅射镀金属膜实验

沈志刚1, 俞晓正1, 徐政2, 裴喜华3   

  1. 1. 北京航空航天大学 航空科学与工程学院, 北京 100083;
    2. 北京有色金属研究总院, 北京 100088;
    3. 国家纳米技术产业化基地, 天津 300457
  • 收稿日期:2006-05-22 出版日期:2006-10-31 发布日期:2010-09-19
  • 作者简介:沈志刚(1958-), 男, 江苏无锡人, 教授, shenzhg@buaa.edu.cn.
  • 基金资助:

    航空基金资助项目(05H51046); 北京市教育委员会共建项目建设计划资助项目(SYS100060413)

Plating metal film on the surface of particles using magnetron sputtering method

Shen Zhigang1, Yu Xiaozheng1, Xu Zheng2, Pei Xihua3   

  1. 1. School of Aeronautic Science and Technology, Beijing University of Aeronautics and Astronautics, Beijing 100083, China;
    2. General Research Institute for Non-ferrous Metals, Beijing 100088, China
  • Received:2006-05-22 Online:2006-10-31 Published:2010-09-19

摘要: 采用磁控溅射方法,成功地在微颗粒表面沉积了金属铜膜和金属镍膜.利用光学显微镜(OM)、场发射扫描电子显微镜(FESEM)、能谱仪(EDS)、多功能扫描探针显微镜(SPM)、电感耦合等离子体发射光谱仪(ICP-AES)和光电子能谱仪(XPS)等测试仪器对其表面形貌、膜厚和组份进行了表征.重点讨论了不同的沉积条件对薄膜结晶的影响,并用X射线衍射仪(XRD)对其进行了表征.结果表明,溅射镀膜时,通过控制微颗粒的运动方式,可以在微颗粒表面镀上均匀性好、附着力强和致密性好的金属膜.溅射时间越长或溅射功率越大或装载量越少,都有利于薄膜结晶.

Abstract: The metal copper and nickel film was deposited on particles by direct current magnetron sputtering method under different working conditions. The surface morphology, film thickness, chemical composition, film grain size as well as the film crystallization of particles were analyzed by optical microscope (OM), field emission scanning electron microscopy (FESEM), energy dispersive spectroscopy (EDS), multimode scanning probe microscope (SPM),inductively coupled plasma-atom emission spectrometer (ICP-AES), X-ray photoelectron spectroscopic (XPS) and X-ray diffraction (XRD) respectively before and after the plating process. The effects of different sputtering conditions on crystallization of metal films deposited on particles were discussed. The results indicate that the relatively uniform, compact and adhesive metal films were successfully deposited on particles through controlling the motion mode of particles during the sputter deposition. With the increasing of sputtering time or the increasing of sputtering power or the decreasing of the particle loading amount, both crystallization and grain size of metal film were improved.

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