基于内聚力模型的透波罩黏接强度性能研究

侯保江; 王姣; 邢誉峰; 张飞; 李焱喜

doi:10.13700/j.bh.1001-5965.2023.0790

基于内聚力模型的透波罩黏接强度性能研究

doi: 10.13700/j.bh.1001-5965.2023.0790

侯保江^{1, 2, ,},
王姣²,
邢誉峰¹,
张飞²,
李焱喜²

1.
北京航空航天大学航空科学与工程学院，北京 100191
2.
北京航天长征飞行器研究所，北京 100076

详细信息

通讯作者:
E-mail：153327058@qq.com

中图分类号: V221⁺.3；TB553
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出版历程
- 收稿日期: 2023-12-04
- 录用日期: 2024-03-11
- 网络出版日期: 2024-04-15
- 整期出版日期: 2025-06-30

Performance study on bonding strength of radome based on cohesive zone model

1.
School of Aeronautic Science and Engineering，Beihang University，Beijing 100191，China
2.
Beijing Institute of Space Long March Vehicle，Beijing 100076，China

More Information

Corresponding author: E-mail：153327058@qq.com

摘要

摘要:
透波罩与飞行器本体往往通过胶黏+辅助连接的方式进行连接，在实际工程应用中，通常将线弹性本构作为胶黏剂的本构模型进行分析，该方法难以对相关黏接结构的力学行为进行准确模拟。基于此，采取常用的双线性内聚力本构模型，通过胶黏剂实际性能的测试结果对本构模型进行校正，采用平板模拟实际黏接结构的性能试验进一步验证复杂受力环境下模型的有效性，并将验证后的本构模型用于分析实际整机级透波罩的黏接强度，并与实际试验结果进行对比，验证双线性内聚力本构模型的计算精度，为类似结构黏接强度的准确预测提供有效途径。
- 内聚力 /
- 双线性 /
- 透波罩 /
- 黏接强度 /
- 数值仿真
Abstract:
The radome and aircraft are often connected by adhesive bonding and auxiliary connection. With the development of aircraft technologies, higher requirements are raised by severe thermo-mechanical environments for the properties of bonding structure during flight. In practical engineering applications, the linear elastic constitutive model is usually used as the constitutive model of adhesives for analysis. The calculation results often greatly deviate from the actual bearing capacity, and it is difficult to accurately simulate the mechanical behavior of the related bonding structures. The frequently used bilinear cohesive constitutive model was employed in this paper. First, the constitutive model was calibrated by the test results of the actual performance of the adhesive. Then, the effectiveness of the model under a complex stress environment was further verified by the performance test of the actual bonding structure at the level of the surface plate. The verified constitutive model was used to analyze the bonding strength for aircraft-level radome, and the results were compared with the actual test results. The calculation accuracy of the model was verified, which provided an effective way for accurately predicting the bonding strength of similar structures in the future.
- cohesion /
- bilinear /
- radome /
- bonding strength /
- numerical simulation

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图 1 双线型模型牵引力-位移曲线

Figure 1. Traction-displacement curve of bilinear model

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图 2 单一型断裂双线性本构关系^[31]

Figure 2. Bilinear constitutive relation of single-mode fracture^[31]

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图 3 胶层性能测试有限元模型

Figure 3. Finite element model of performance test for adhesive layer

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图 4 平板级连接有限元模型

Figure 4. Finite element model at level of surface plate

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图 5 胶接状态预测结果

Figure 5. Predicted results of adhesive bonding state

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图 6 胶接+销钉状态预测结果

Figure 6. Predicted results of adhesive bonding + pin state

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图 7 胶接状态试验载荷曲线

Figure 7. Curves of test load of adhesive bonding state

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图 8 胶接+销钉状态试验载荷曲线

Figure 8. Curves of test load of adhesive bonding + pin state

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图 9 透波罩连接结构示意图

Figure 9. Connection structure for radome

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图 10 透波罩有限元模型局部结构

Figure 10. Local structure of finite element model for radome

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图 11 静力载荷工况下变形情况

Figure 11. Deformation under static load conditions

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图 12 静力载荷工况下罩体损伤分布

Figure 12. Damage distribution of radome under static load

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图 13 力热耦合工况下胶层失效力学性能

Figure 13. Adhesive failure and mechanical property under thermo-mechanical coupling

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图 14 力热耦合工况下罩体损伤分布

Figure 14. Damage distribution of radome under thermo-mechanical coupling

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表 1 Cohesive单元的模型参数

Table 1. Model parameters of Cohesive elements

温度/°C	弹性模量/ GPa	G_{Ⅰ C}/（J·m⁻²）	G_{Ⅱ C}/（J·m⁻²）
室温	3.2	78.42	148.99
170	2.6	51.53	91.40
250	1.1	16.39	30.17

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表 2 胶层力学性能参数

Table 2. Mechanical parameters of adhesive layer

加载方式	强度测试值/MPa							仿真结果/ MPa	误差/%
加载方式	1#	2#	3#	4#	5#	6#	平均值	仿真结果/ MPa	误差/%
拉剪	15.3	17	20.5	15	14.8	14.4	16.17	17.1	5.75
压剪	74.3	80.9	78.3	66.7	70.2	75.7	74.35	71.08	−4.4
拉离	66.9	51.4	56.4	47.9	36.9	68.5	56.42	53.37	−5.41

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表 3 极限载荷试验结果与计算结果对比

Table 3. Comparison between experimental and calculated results under ultimate load

连接状态	温度条件	载荷/kN		误差/%
连接状态	温度条件	计算值	试验值	误差/%
胶接	室4温	65.8	68	−3.2
胶接+销钉	室温	76.1	82	−7.2
胶接	170 ℃	28.6	30.4	−5.9
胶接+销钉	170 ℃	47.7	50	−4.6
胶接	250 ℃	1.06	1	6
胶接+销钉	250 ℃	22.5	23.3	−3.4

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