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湿热环境下湿度对塑封器件贮存可靠性的影响

刘慧丛 邢阳 李卫平 朱立群

刘慧丛, 邢阳, 李卫平, 等 . 湿热环境下湿度对塑封器件贮存可靠性的影响[J]. 北京航空航天大学学报, 2010, 36(9): 1089-1093.
引用本文: 刘慧丛, 邢阳, 李卫平, 等 . 湿热环境下湿度对塑封器件贮存可靠性的影响[J]. 北京航空航天大学学报, 2010, 36(9): 1089-1093.
Liu Huicong, Xing Yang, Li Weiping, et al. Effect of humidity on storage reliability of plastic encapsulated microcircuits devices in hygrothermal environment[J]. Journal of Beijing University of Aeronautics and Astronautics, 2010, 36(9): 1089-1093. (in Chinese)
Citation: Liu Huicong, Xing Yang, Li Weiping, et al. Effect of humidity on storage reliability of plastic encapsulated microcircuits devices in hygrothermal environment[J]. Journal of Beijing University of Aeronautics and Astronautics, 2010, 36(9): 1089-1093. (in Chinese)

湿热环境下湿度对塑封器件贮存可靠性的影响

基金项目: 航天科技创新基金资助项目(CASC0504)
详细信息
    作者简介:

    刘慧丛(1975-),女,河北无极人,讲师,liuhc@buaa.edu.cn.

  • 中图分类号: TN 43

Effect of humidity on storage reliability of plastic encapsulated microcircuits devices in hygrothermal environment

  • 摘要: 针对塑封电子器件在湿热环境下的贮存可靠性问题,通过湿热实验考察了湿热环境中的湿度因素对某型塑封器件贮存过程中的吸湿行为、封装表面状态以及电性能的影响.结果表明:环境湿度对塑封器件吸湿过程有显著影响,在同样的温度下相对湿度越高,器件的吸水速率越大,达到饱和时的饱和水汽含量也越大,而湿度对器件水汽吸收达到饱和时间的影响比较小,一般贮存300h后水汽含量都达到饱和;塑封器件在湿热环境下贮存的主要失效模式是外引线腐蚀,且随着相对湿度增加腐蚀程度更加严重,分析认为器件封装过程中在外引线表面造成的断口、裂纹和针孔等缺陷处是腐蚀发生的敏感区;在贮存期内湿度对塑封器件的电性能影响不大.

     

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出版历程
  • 收稿日期:  2009-06-15
  • 网络出版日期:  2010-09-30

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