Effect of humidity on storage reliability of plastic encapsulated microcircuits devices in hygrothermal environment
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摘要: 针对塑封电子器件在湿热环境下的贮存可靠性问题,通过湿热实验考察了湿热环境中的湿度因素对某型塑封器件贮存过程中的吸湿行为、封装表面状态以及电性能的影响.结果表明:环境湿度对塑封器件吸湿过程有显著影响,在同样的温度下相对湿度越高,器件的吸水速率越大,达到饱和时的饱和水汽含量也越大,而湿度对器件水汽吸收达到饱和时间的影响比较小,一般贮存300h后水汽含量都达到饱和;塑封器件在湿热环境下贮存的主要失效模式是外引线腐蚀,且随着相对湿度增加腐蚀程度更加严重,分析认为器件封装过程中在外引线表面造成的断口、裂纹和针孔等缺陷处是腐蚀发生的敏感区;在贮存期内湿度对塑封器件的电性能影响不大.Abstract: According to the storage reliability problems of plastic encapsulated microcircuits (PEM) devices in hygrothermal environment, effect of humidity on moisture absorption, surface estate and electrical performance of PEM was investigated through hygrothermal test. The results show that, humidity in the environment obviously affects moisture absorption process of PEM; Along with higher relative humidity at the same temperature, moisture absorption rate becomes bigger and moisture absorption content grows larger, but moisture has little effect on the time for moisture absorption content getting the biggest, moisture absorption content usually has the biggest value after 300h; Corrosion of component leads was found to be a main failure mode of PEM in hygrothermal environment, and the components have higher corrosion grade if the relative humidity is higher, and the defects, cracks and pinholes on the leads are considered to be the corrosion susceptible sites of the devices; In the tested storage time, humidity in the environment has little effect on the electrical performance of PEM.
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Key words:
- plastic encapsulation /
- electronic components /
- humidity /
- hygrothermal environment /
- storage reliability /
- corrosion
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