湿热环境下湿度对塑封器件贮存可靠性的影响

刘慧丛; 邢阳; 李卫平; 朱立群

湿热环境下湿度对塑封器件贮存可靠性的影响

北京航空航天大学材料科学与工程学院, 北京 100191

基金项目: 航天科技创新基金资助项目(CASC0504)

详细信息

作者简介:
刘慧丛(1975-),女,河北无极人,讲师,liuhc@buaa.edu.cn.

中图分类号: TN 43
计量
- 文章访问数: 4123
- HTML全文浏览量: 216
- PDF下载量: 1946
- 被引次数: 0
出版历程
- 收稿日期: 2009-06-15
- 网络出版日期: 2010-09-30

Effect of humidity on storage reliability of plastic encapsulated microcircuits devices in hygrothermal environment

School of Materials Science and Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100191, China

摘要

摘要: 针对塑封电子器件在湿热环境下的贮存可靠性问题,通过湿热实验考察了湿热环境中的湿度因素对某型塑封器件贮存过程中的吸湿行为、封装表面状态以及电性能的影响.结果表明:环境湿度对塑封器件吸湿过程有显著影响,在同样的温度下相对湿度越高,器件的吸水速率越大,达到饱和时的饱和水汽含量也越大,而湿度对器件水汽吸收达到饱和时间的影响比较小,一般贮存300h后水汽含量都达到饱和;塑封器件在湿热环境下贮存的主要失效模式是外引线腐蚀,且随着相对湿度增加腐蚀程度更加严重,分析认为器件封装过程中在外引线表面造成的断口、裂纹和针孔等缺陷处是腐蚀发生的敏感区;在贮存期内湿度对塑封器件的电性能影响不大.
- 塑封 /
- 电子元器件 /
- 湿度 /
- 湿热环境 /
- 贮存可靠性 /
- 腐蚀
Abstract: According to the storage reliability problems of plastic encapsulated microcircuits (PEM) devices in hygrothermal environment, effect of humidity on moisture absorption, surface estate and electrical performance of PEM was investigated through hygrothermal test. The results show that, humidity in the environment obviously affects moisture absorption process of PEM; Along with higher relative humidity at the same temperature, moisture absorption rate becomes bigger and moisture absorption content grows larger, but moisture has little effect on the time for moisture absorption content getting the biggest, moisture absorption content usually has the biggest value after 300h; Corrosion of component leads was found to be a main failure mode of PEM in hygrothermal environment, and the components have higher corrosion grade if the relative humidity is higher, and the defects, cracks and pinholes on the leads are considered to be the corrosion susceptible sites of the devices; In the tested storage time, humidity in the environment has little effect on the electrical performance of PEM.
- plastic encapsulation /
- electronic components /
- humidity /
- hygrothermal environment /
- storage reliability /
- corrosion

HTML全文

参考文献(1)

[1] 曾晨晖.塑封半导体器件失效率模型研究 .北京:北京航空航天大学工程系统工程系,2006:1-5 Zeng Chenhui.Research on failure rate model of plastic encapsulated semiconductor devices .Beijing:Dept of System Engineering of Engineering Technology,Beijing University of Aeronautics and Astronautics,2006:1-5(in Chinese) [2] 李海岸.航空塑封器件的使用控制和DPA实验方法研究 .北京:北京航空航天大学工程系统工程系,2007:1-3 Li Hai’an.The research of application control & DPA methods of aeronautic plastic encapsulated microcircuits .Beijing:Dept of System Engineering of Engineering Technology,Beijing University of Aeronautics and Astronautics,2007:1-3(in Chinese) [3] 邢阳,刘慧丛,李卫平,等.贮存环境下塑封器件吸湿规律的神径网络预测[J].新技术新工艺,2008(11):24-27 Xing Yang,Liu Huicong,Li Weiping,et al.Prediction of humidity absorbing rule for plastic encapsulated devices in storage environment by network model[J].New Technology & New Process,2008(11):24-27(in Chinese) [4] 李青.电子材料的腐蚀[J].电子元件与材料,1996,15(6):48-50 Li Qing.Corrosion of electronic materials[J].Electron Compon Mater,1996,15(6):48-50(in Chinese) [5] Zhao Ping,Pecht Michael.Mixed flowing gas studies of creep corrosion on plastic encapsulated microcircuit packages with noble metal pre-plated leadframes[J].IEEE Transactions on Device and Materials Reliability,2005,5(2):268-276 [6] 朱立群,杜岩滨,李卫平,等.手机PCB镀金接插件腐蚀失效实例分析[J].电子产品可靠性与环境实验,2006(4):4-8 Zhu Liqun,Du Yanbin,Li Weiping,et al.Corrosive failure cases analysis of PCB with parts of Au-plating for mobile telephone[J].Electronic Product Reliability and Environmental Testing,2006(4):4-8(in Chinese) [7] 马志宏,李金国.湿热环境应力下产品失效机理分析[J].环境技术,2006(5):31-33 Ma Zhihong,Li Jinguo.Failure analysis for the effect on products in the humidity-s and temperature-s envronmental stress[J].Environmental Technology,2006(5):31-33(in Chinese) [8] Galloway J E,Miles B M.Moisture absorption and desorption predictions for plastic ball grid array packages[J].IEEE Components,Packaging and Manufacturing Technology,1997,20(3):274-279 [9] 别俊龙,孙学伟,贾松良.吸收湿气对微电子塑料封装影响的研究进展[J].力学进展,2007,37(1):35-47 Bie Junlong,Sun Xuewei,Jia Songliang.Recent advances in the study of moisture absorption in plastic electronic packaging[J].Advances in Mechanics,2007,37(1):35-47(in Chinese) [10] 杨少华.电子元器件的贮存可靠性研究 .广州:广东工业大学轻工化工学院,2006 Yang Shaohua.Evaluation of non-operating relibailtiy for electronic components .Guangzhou:Faculty of Light and Chemical,Guangdong University of Technology,2006(in Chinese) [11] 杜迎,管光宝.集成电路抗腐蚀能力的研究[J].电子产品可靠性与环境实验,2005(4):30-33 Du Ying,Guan Guangbao.The research of corrosion resistance for ICs[J].Electronic Product Reliability and Environmental Testing,2005(4):30-33(in Chinese) [12] Luo Guoping,Xu Liangjun,Zhang Jigao.Combination effect of fretting and corrosion on bolt-type power connectors //Proceedings of the Forty-Sixth IEEE Holm Conference.Piscataway,NJ:IEEE,2000:60-66

施引文献

资源附件(0)

访问统计