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芯片互联结构断裂失效的试验研究与统计分析

陈垚君 景博 胡家兴 盛增津 张钰林

陈垚君, 景博, 胡家兴, 等 . 芯片互联结构断裂失效的试验研究与统计分析[J]. 北京航空航天大学学报, 2019, 45(2): 381-387. doi: 10.13700/j.bh.1001-5965.2018.0315
引用本文: 陈垚君, 景博, 胡家兴, 等 . 芯片互联结构断裂失效的试验研究与统计分析[J]. 北京航空航天大学学报, 2019, 45(2): 381-387. doi: 10.13700/j.bh.1001-5965.2018.0315
CHEN Yaojun, JING Bo, HU Jiaxing, et al. Experimental research and statistical analysis of fracture failure for interconnected structures in electronic chips[J]. Journal of Beijing University of Aeronautics and Astronautics, 2019, 45(2): 381-387. doi: 10.13700/j.bh.1001-5965.2018.0315(in Chinese)
Citation: CHEN Yaojun, JING Bo, HU Jiaxing, et al. Experimental research and statistical analysis of fracture failure for interconnected structures in electronic chips[J]. Journal of Beijing University of Aeronautics and Astronautics, 2019, 45(2): 381-387. doi: 10.13700/j.bh.1001-5965.2018.0315(in Chinese)

芯片互联结构断裂失效的试验研究与统计分析

doi: 10.13700/j.bh.1001-5965.2018.0315
基金项目: 

“十三五”装备预研共用技术 41402010102

详细信息
    作者简介:

    陈垚君  男, 硕士研究生。主要研究方向:电子封装可靠性

    景博  女, 博士, 教授, 博士生导师。主要研究方向:故障诊断与健康管理、测试性设计、传感器网络与信息融合

    通讯作者:

    景博, E-mail: jingbo_sensor@163.com

  • 中图分类号: TH311

Experimental research and statistical analysis of fracture failure for interconnected structures in electronic chips

Funds: 

National Defence Pre-research Foundation of China 41402010102

More Information
  • 摘要:

    针对电子芯片互联结构失效机理复杂、寿命数据难以获取且缺乏具有理论依据支撑的寿命分布模型等问题,开展了基于退化试验数据的统计分析研究,并提出了2种统计建模方法。首先,搭建了电子芯片可靠性评估试验台,利用菊花链测试芯片为试验对象获取了互联结构的退化数据和寿命数据;其次,基于断裂力学理论,分析了互联结构断裂失效的失效机理,给出了BGA封装形式的电子芯片互联结构寿命分布服从两参数威布尔分布的理论依据,由此建立了基于寿命数据的电子芯片互联结构寿命分布模型;再次,利用退化量的分布建立了基于退化量数据的电子芯片互联结构寿命分布模型;最后,对2种统计建模方法进行比较分析。结果表明,基于退化量数据的寿命分布模型与基于寿命数据的寿命分布模型吻合度良好,2种分析方法在结果上具有一致性。

     

  • 图 1  菊花链测试芯片互联结构连接图

    Figure 1.  Connection diagram of interconnected structure of daisy-chain test chip

    图 2  随机振动试验件

    Figure 2.  Test piece for random vibration

    图 3  试验件的振动特性

    Figure 3.  Vibration characteristics of test piece

    图 4  菊花链测试芯片互联结构的退化过程

    Figure 4.  Degradation process of interconnected structure of daisy-chain test chip

    图 5  菊花链测试芯片互联结构累计退化量

    Figure 5.  Accumulated degradation of interconnected structure of daisy-chain test chip

    图 6  互联结构累计退化量的均值和标准差随时间变化

    Figure 6.  Variation of mean value and standard deviation of accumulated degradation of interconnected structure with time

    图 7  菊花链测试芯片互联结构的寿命分布

    Figure 7.  Lifetime distribution of interconnected structure of daisy-chain test chip

    表  1  各组试验件的累计失效时间

    Table  1.   Accumulative failure time for each group of test piece

    试验组 累积失效时间/s
    1 60 627
    2 118 618
    3 42 017
    4 165 376
    5 26 115
    下载: 导出CSV

    表  2  两参数威布尔分布的参数估计

    Table  2.   Parameter estimation of two-parameter Weibull distribution

    参数 数值
    形状参数m 1.667
    尺度参数η 93 002
    下载: 导出CSV
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出版历程
  • 收稿日期:  2018-06-01
  • 录用日期:  2018-09-03
  • 刊出日期:  2019-02-20

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