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电解铜箔材料中晶面择优取向

张世超 蒋涛 白致铭

张世超, 蒋涛, 白致铭等 . 电解铜箔材料中晶面择优取向[J]. 北京航空航天大学学报, 2004, 30(10): 1008-1012.
引用本文: 张世超, 蒋涛, 白致铭等 . 电解铜箔材料中晶面择优取向[J]. 北京航空航天大学学报, 2004, 30(10): 1008-1012.
Zhang Shichao, Jiang Tao, Bai Zhiminget al. Preferred orientation of electrolytic copper foil[J]. Journal of Beijing University of Aeronautics and Astronautics, 2004, 30(10): 1008-1012. (in Chinese)
Citation: Zhang Shichao, Jiang Tao, Bai Zhiminget al. Preferred orientation of electrolytic copper foil[J]. Journal of Beijing University of Aeronautics and Astronautics, 2004, 30(10): 1008-1012. (in Chinese)

电解铜箔材料中晶面择优取向

基金项目: 国家863基金资助项目(2002AA302402)
详细信息
    作者简介:

    张世超(1963-),男,河南灵宝人,教授, CSC@buaa.edu.cn.

  • 中图分类号: TQ 1531

Preferred orientation of electrolytic copper foil

  • 摘要: 采用含有硫脲、明胶添加剂的硫酸盐电沉积体系,利用X射线衍射仪(XRD)、万能试验机等手段研究了不同电沉积条件下制备的铜箔材料的择优取向特征及其对铜箔机械性能的影响.结果表明,较大电流密度下,以硫脲为添加剂生产的电解铜箔出现(220)面择优取向,织构程度受到铜箔厚度、电流密度影响,最大织构系数TC(220)达到93.2%.此外,铜箔发生择优取向与添加剂有关,相同条件下,以骨胶为添加剂生产的电解铜箔未出现明显的择优取向特征.同时,铜箔表面并没有出现择优晶向,保证了铜箔沿平面方向上抗拉强度及延伸率的稳定.

     

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出版历程
  • 收稿日期:  2004-04-28
  • 刊出日期:  2004-10-31

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