The numerical detailed model and compact model were created for plastic quad flat package(PQFP), and the accuracy of two models was verified by the measurement values. The steady thermal performance of PQFP was studied under harsh environment, and factors effecting on the inner and outer thermal resistances were analyzed. Results show that using the multi-layer structure is a perfect way to improve the thermal performance, and forced air velocity around the PQFP should be lower than 5m/s. The transient thermal performance of PQFP was discussed for two cases: pulse heat loads and the ambient air temperature varying with time. Thermal responses of the die were got, which could be used to study the thermal stress, disability, and signal fuzzy, and be a basis for improving package’s thermal design.
Hanreich G, Nicolics J, Musiejovsky L.High resolution thermal simulation of electronic components[J].Microelectronics and Reliability.2000, 40(12):2069-2076
Admas V H, Blackburn D L, Joshi Y.Package geometry considerations in thermal compact modeling strategies Bardon J P,Beyne E,Saulnier J B. Thermal Management of Electronic Systems III. Paris:Elsevier\|Service Abonnements, 1997:122-130
Aghazadeh M, Mallik D. Thermal characteristics of single and multi-layer high performance PQFP packages Proc IEEE Semicond Therm Temp Meas Symp. Piscataway:IEEE,1990:33-39
Zhou Tiao, Hundt M. Board and system level effects on plastic package thermal performance[J].Proc Electron Compon Technol Conf,1996:911-917
Davies M R D, Cole R, Lohan J. Factors affecting the operational thermal resistance of electronic components[J].Journal of Electronic Packaging, Transactions of the ASME.2000, 122(3):185-191
JESD 51-3:low effective thermal conductivity test board for leaded surface mount packages .1999-10.http://www.jedec.com
��JESD 51-7:high effective thermal conductivity test board for leaded surface mount packages .1999-10.http://www.jedec.com