| Citation: | CHEN Yaojun, JING Bo, HU Jiaxing, et al. Experimental research and statistical analysis of fracture failure for interconnected structures in electronic chips[J]. Journal of Beijing University of Aeronautics and Astronautics, 2019, 45(2): 381-387. doi: 10.13700/j.bh.1001-5965.2018.0315(in Chinese)
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Aimed at the problems of complex failure mechanism of interconnected structures in electronic chips, difficulty in obtaining lifetime data, and lack of a theoretically supported life distribution model, a statistical analysis based on degraded experimental data was conducted. First, an electronic chip reliability evaluation testbed is built, and the daisy-chain test chip is used as the test object. Degradation data and lifetime data of interconnected structures are acquired. Then, based on the theory of fracture mechanics, The failure mechanism of interconnection structure is analyzed. The theoretical basis of the two-parameter Weibull distribution of the life distribution of the interconnection structure of electronic chips in BGA package is given. The life distribution model of the interconnection structure of electronic chips based on the life data is established. Next, using the distribution of degradation, a lifetime distribution model of the interconnected structures in electronic chips is established. Finally, the two statistical modeling methods are compared. The results show that the lifetime distribution model based on degradation data is in good agreement with that based on lifetime data.
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