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Volume 42 Issue 5
May  2016
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Journal of Beijing University of Aeronautics and Astronautics  > 2016  >  42(5): 992-998.
XIANG Zhongyuan, ZHANG Feng. Thermal flux compression algorithm to enhance RRAM reliability[J]. Journal of Beijing University of Aeronautics and Astronautics, 2016, 42(5): 992-998. doi: 10.13700/j.bh.1001-5965.2015.0336(in Chinese)
Citation: XIANG Zhongyuan, ZHANG Feng. Thermal flux compression algorithm to enhance RRAM reliability[J]. Journal of Beijing University of Aeronautics and Astronautics, 2016, 42(5): 992-998. doi: 10.13700/j.bh.1001-5965.2015.0336(in Chinese)
shu

Thermal flux compression algorithm to enhance RRAM reliability

doi: 10.13700/j.bh.1001-5965.2015.0336

  • Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China

  • Received Date: 26 May 2015
  • Publish Date: 20 May 2016
    Abstract
  • A thermal flux compression (TFC) algorithm is proposed through the research on the thermal crosstalk in resistive random access memory (RRAM) to strengthen the RRAM reliability. By adding TFC algorithm before RRAM read-write circuit and reducing Joule heat produced in RRAM, thermal crosstalk in RRAM could be weakened and RRAM reliability could be enhanced. With the analysis and computation of real Joule heat produced in write data flow, TFC algorithm could judge whether to flip data, in order to reduce the Joule heat in RRAM, that is, TFC algorithm would choose the one with lower thermal flux between original write data flow and flipped encode data flow through the algorithm layer. Theoretical analysis and simulation results show that TFC algorithm could reduce more than 30% write Joule heat on average and valuation of resistive unit retention could increase by over 35% on average, with byte as the unite data block.

     

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