| Citation: | CHEN Xingyu, WANG Liyan, CHEN Weihua, et al. Transpiration cooling test of porous plate in vacuum environment[J]. Journal of Beijing University of Aeronautics and Astronautics, 2021, 47(8): 1594-1604. doi: 10.13700/j.bh.1001-5965.2020.0257(in Chinese)
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During high speed flight, the temperatures of the vehicle can reach extremely high values in the critical parts. To solve the problem of thermal protection for the critical parts, series of transpiration cooling tests using different materials as porous plate and water as coolant were carried out. The experimental platform which was used for the transient measurement in transpiration cooling process was developed. The cooling effects of different material porous plates under different heat flux were evaluated by measuring the inter and outer wall temperature.The results of the experiment indicate that transpiration cooling greatly reduces the temperature of the inner and outer walls of the porous plate, which plays an effective role in active thermal protection. For nickel and copper metal porous plates, the coolant flow rate is kept at about 3.5 g/s and the temperature of inner and outer wall is stable at about 30℃-50℃ when the heat flux is less than 120 kW/m2. And for ceramic porous plates, the coolant water flow rate is kept at about 0.32 g/s, and the temperature of inner and outer wall is basically stable at about 30℃-40℃ when the heat flux is less than 220 kW/m2. Moreover, for nickel, copper and ceramic porous plates, the temperature of the inner wall changes little under the condition of high heat flux of 315 kW/m2 during transpiring cooling, and the outer wall temperature stabilizes at about 260℃, 110℃ and 130℃, respectively. The coolant on the outer wall surface is in a completely vaporized state, and the vaporized phase transition position of the coolant is inside the porous plate. In addition, the temperature of the inner and outer walls of the porous plate rises rapidly when there is no transpiration cooling, and its equilibrium temperature is greatly increased compared with the transpiration cooling situation, which further shows the enormous application potential of transpiration cooling.
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