| Citation: | ZHONG J C，XU H J，WEI X L，et al. Detection of debonding defect in CFRP laminates using infrared pulse thermal wave tomography[J]. Journal of Beijing University of Aeronautics and Astronautics，2023，49（7）：1847-1856 （in Chinese） doi: 10.13700/j.bh.1001-5965.2021.0555
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To achieve the three-dimensional tomography for detecting debonding defects of carbon fiber reinforced plastic (CFRP) laminates based on infrared pulse thermal wave imaging, consummate the out-field quantitative detection guarantee system, and improve the safety and reliability of laminates in service, research on infrared pulse thermal wave tomography method and detection technology is carried out. A specimen with artificial debonding defects was prepared, infrared pulse thermal wave imaging technology is employed to detect debonding defects. The transient response process of surface thermal signal in debonding and sound region and detection ability of infrared pulse thermal wave imaging are analyzed. Through reconstructed thermal signal difference between debonding and sound region based on logarithmic polynomial fitting, extreme time of thermal signal are calculated, and the change law of debonding region extreme time and defect state are analyzed;. Kernel fuzzy C-means clustering is used to classify extreme time array corresponding to the same defect depth, and the array average value is calculated as defect extreme time. Statistical relationship between the time and debonding region extreme time array is established to construct tomographic images sequence, and the corresponding defect depth is calculated. Three-dimensional visualization of debonding defects in laminate is achieved by isosurface drawing method. Research shows that infrared pulse thermal wave tomography can detect debonding defects of CFRP laminate. This method can accurately and reliably display distribution and morphology of internal defects in laminate. Maximum relative deviation between detected and actual defect depth is less than 15%, which has certain guiding significance for engineering application.
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