| Citation: | WU L，TENG J F，LYU Y L，et al. Experimental study on kinetics of TLP diffusion bonding of GH3230 alloy[J]. Journal of Beijing University of Aeronautics and Astronautics，2024，50（8）：2595-2600 （in Chinese） doi: 10.13700/j.bh.1001-5965.2022.0644
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The transient liquid-phase (TLP) diffusion connection can obtain welds similar to the tissue performance of the parent material, so it has become an important bonding technology for the nickel-based superalloy structure of the aviation engine thermal end component and is widely used. The isothermal solidification of the liquid phase during the TLP diffusion bonding to form the solid solvent organization without the precipitates is the core link of the TLP diffusion bonding mechanism and the process dynamics. The TLP diffusion connection process of GH3230 alloy is carried out in the ways of an amorphous intermediate layer based on nickel by using the Co element in the middle layer as the tracer atom. The results focus on the element diffusion and distribution characteristics of the TLP diffusion bonding weld area under different connection time conditions. The maximum width of liquid phase is 72 μm. At the welding temperature of
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