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Journal of Beijing University of Aeronautics and Astronautics  > 2025  > Accepted Manuscript
XUE Xiaofeng, DONG Zheng, HUANG Chaowei, et al. Stochastic modeling and reliability analysis of airborne conformal antenna solder joints under thermomechanical coupling[J]. Journal of Beijing University of Aeronautics and Astronautics. doi: 10.13700/j.bh.1001-5965.2025.0279(in Chinese)
Citation: XUE Xiaofeng, DONG Zheng, HUANG Chaowei, et al. Stochastic modeling and reliability analysis of airborne conformal antenna solder joints under thermomechanical coupling[J]. Journal of Beijing University of Aeronautics and Astronautics. doi: 10.13700/j.bh.1001-5965.2025.0279(in Chinese)
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Stochastic modeling and reliability analysis of airborne conformal antenna solder joints under thermomechanical coupling

doi: 10.13700/j.bh.1001-5965.2025.0279
  • Available Online: 23 Sep 2025

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