Volume 32 Issue 01
Jan.  2006
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Liu Xuemei, Zhang Yanhua. Numerical simulation of consumable-rod’s thermal-mechanical behavior in friction surfacing[J]. Journal of Beijing University of Aeronautics and Astronautics, 2006, 32(01): 83-87. (in Chinese)
Citation: Liu Xuemei, Zhang Yanhua. Numerical simulation of consumable-rod’s thermal-mechanical behavior in friction surfacing[J]. Journal of Beijing University of Aeronautics and Astronautics, 2006, 32(01): 83-87. (in Chinese)

Numerical simulation of consumable-rod’s thermal-mechanical behavior in friction surfacing

  • Received Date: 12 Nov 2004
  • Publish Date: 31 Jan 2006
  • By finite element method and rigid-viscoplastic model, the coupling of 3-D temperature field and deformation field of consumable-rod during friction surfacing process was simulated. Temperature change and deformation of consumable-rod were analyzed. The factors influencing temperatures were discussed. Temperature change of consumable-rod was measured by thermocouple. It was showed in the simulation results that the temperature increase rate at friction interface was higher at first, then became lower. Once the friction system became quasi-steady, the temperature here would be stable approximately. Special temperature gradient was found at consumable-rod’s bottom end. The friction interface firstly became viscoplastic and then deformed. The largest effective strain existed near the center of the bottom of the circle. The simulation results are consistent with experiments, reappearing temperature change and deformation of consumable-rod during friction surfacing. The results can be helpful in the study of process mechanism and supplying the theoretical guide to choose key technical parameters in engineering practice.

     

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