Volume 29 Issue 8
Aug.  2003
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Fang Zhiqiang, Fu Guicui, Gao Zexiet al. Application research on thermal analysis software of electronic systems[J]. Journal of Beijing University of Aeronautics and Astronautics, 2003, 29(8): 737-740. (in Chinese)
Citation: Fang Zhiqiang, Fu Guicui, Gao Zexiet al. Application research on thermal analysis software of electronic systems[J]. Journal of Beijing University of Aeronautics and Astronautics, 2003, 29(8): 737-740. (in Chinese)

Application research on thermal analysis software of electronic systems

  • Received Date: 30 Jun 2002
  • Publish Date: 31 Aug 2003
  • The temperature field of a product can be picked up to optimize the design and improve the reliability by the technology of thermal analysis in the phase of design. Based on the characters of thermal analysis software, some problems in their application are discussed. With a simple example, the whole process of thermal analysis is presented, and several application solutions are given. The results show that if the main problems are solved correctly, a good thermal analysis will be gained to meet the demands of engineering.

     

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  • [1] 于慈远. 计算机辅助电子设备热分析、热设计及热测量技术的研究. 北京:北京航空航天大学工程系统工程系,2000 Yu Ciyuan. Research on technique of computer aided thermal analysis, design and test on electronic equipments. Beijing University of Aeronautics and Astronautics, Dept of Systems Engineering of Engineering Technology, 2000(in Chinese) [2] Flotherm introduction. 上海:Flomerics Inc中国代表处,2001 Flotherm introduction. Shanghai:Flomerics Inc,2001(in Chinese) [3] Clemens J M. The conceivable accuracy of experimental and numerical thermal analyses of electronic systems. IEEE, 2001 [4] Advanced Thermal Modeling. 北京:海基科技发展有限责任公司,2001 Advanced Thermal Modeling. Beijing:Hi-Key Technology Corporation Ltd, 2001(in Chinese) [5] Yogendra J, Baelmans M, Copeland D, et al. Challenges in thermal modeling of electronics at the system level:summary of panel held at thermionic 2000. IEEE, 2001 [6] 余建祖.电子设备热设计及分析技术[M] 北京:北京航空航天大学出版社,2000.3~10 Yu Jianzu. Technique of thermal design and analysis on electronic equipments. Beijing:Beijing University of Aeronautics and Astronautics Press, 2000.3~10(in Chinese) [7] Ram V, Ihab A Ali. Thermal modeling of high performance packages in portable computers. IEEE,1997 [8] Enrico D, Giuseppe V. Thermal characterization of compact electronic systems:a portable PC as a study case. IEEE, 2002
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