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Citation: Zhu Ying, Tang Shanping, Yan Jianfeng, et al. Comparation of the bonding through sintering between Ag nanoparticle paste and Ag microparticle paste[J]. Journal of Beijing University of Aeronautics and Astronautics, 2013, 39(4): 484-487. (in Chinese)

Comparation of the bonding through sintering between Ag nanoparticle paste and Ag microparticle paste

  • Received Date: 14 May 2012
  • Publish Date: 30 Apr 2013
  • The Ag nanoparticle paste with diameter of 20~80nm and the Ag microparticle paste with diameter of 1~3μm were used to bond Ag coated Cu discs. The shear strength was evaluated using the physical simulators Gleeble 1500D. Microstructure of the joint was studied with scanning electron microscope (SEM) and energy dispersive spectroscopy (EDS). The result shows that the shear strength of the joint using Ag nanoparticle paste is significantly higher than that of joints with Ag microparticle paste at the same parameter. The analysis of the fracture surface and interfacial of joint shows that the joint bonded with Ag nanoparticle has higher sintering density than that of Ag microparticle. In the joint bonded with Ag microparticle, there were cracks at interfacial between the copper disc and sintered silver layer, which may contribute to the low shear strength.

     

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