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Volume 39 Issue 5
May  2013
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Journal of Beijing University of Aeronautics and Astronautics  > 2013  >  39(5): 670-673.
Yin Na, Qu Wenqing, Yang Shujuan, et al. Brittle behavior of gold alloy joint soldered with tin-lead solder[J]. Journal of Beijing University of Aeronautics and Astronautics, 2013, 39(5): 670-673. (in Chinese)
Citation: Yin Na, Qu Wenqing, Yang Shujuan, et al. Brittle behavior of gold alloy joint soldered with tin-lead solder[J]. Journal of Beijing University of Aeronautics and Astronautics, 2013, 39(5): 670-673. (in Chinese)
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Brittle behavior of gold alloy joint soldered with tin-lead solder

  • 1.

    School of Mechanical Engineering and Automation, Beijing University of Aeronautics and Astronautics, Beijing 100191, China

  • 2. Beijing Institute of Control Engineering, Beijing 100080, China

  • Received Date: 29 May 2012
  • Rev Recd Date: 29 Jun 2012
  • Publish Date: 31 May 2013
    Abstract
  • Soldering of Au60AgCu using tin-lead solder was performed in the experiment. The soldering joint of microstructure, micro-hardness, phase composition, mechanical properties and fracture morphology were analyzed, and the effect of interface intermetallic compound on joint brittleness was discussed. It was found that the compound of Au60AgCu alloy soldering joint was composed of AuSn2, Ag3Sn and AuSn4. With increasing the soldering temperature and/or time, the thickness of intermetallic compound was obviously increased. The hardness of intermetallic compound was high. The soldering joint of shear mechanical property test indicates that fracture occurred in the intermetallic compound layer, and the fracture morphology is brittle fracture.

     

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