Citation: | Chen Ying, Huo Yujie, Xie Jingsong, et al. Effects of PWB design factors on PTH reliability[J]. Journal of Beijing University of Aeronautics and Astronautics, 2007, 33(08): 954-958. (in Chinese) |
[1] Michael F, Donald B. Predicting plated though hole life and in the field from thermal stress data IPC Printed Circuits Expo, APEX and the Designers Summit. Los Angeles:The Institute for Interconnecting and Packaging Electronic Circuits, 2006:203-205 [2] Xie Jingsong, Kang Rui, Zhang Yuan, et al. A PTH reliability model considering barrel stress distributions and multiple PTHs in a PWB The 44th Annual IEEE International Reliability Physics Symposium. San Jose:IEEE Electron Device Society and IEEE Reliability Society, 2006:256-265 [3] Mirman B A. Mathematical model of a plated-through hole under a load induced by thermal mismatch[J]. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 1988,11(4):506-511 [4] Iannuzzelli R. Predicting plated-through-hole reliability in high temperature manufacturing processes Proceedings of the 41st Electronic Components and Technology Conference. Atlanta:The IEEE Components, Packaging and Manufacturing Technology Society, 1991:410-421 [5] Xie Jingsong, Huo Yujie, Zhang Yuan, et al. Effect of PWB design factors and glass transition temperature on PTH reliability The 39th International Symposium on Microelectronics. Washington DC:International Microelectronics and Packaging Society and The Microelectronics Foundation, 2006:534-537 [6] Kobayashi T, Hayashida S. A study on reliability modeling for through hole cracking failure in thermal enhanced PBGA laminate Electronic Components and Technology Conference. Las Vegas:The IEEE Components, Packaging and Manufacturing Technology Society, 2000:1658-1660 [7] 孙博,张叔农,谢劲松. PCB镀通孔疲劳寿命对设计参数的灵敏度分析[J].电子元件与材料, 2006,25(9):60-66 Sun Bo, Zhang Shunong, Xie Jingsong. Sensitivity analysis for the dependence of PTH fatigue life on PCB design parameters [J]. Electronics Components and Materials, 2006, 25(9):60-66(in Chinese) [8] Round R. Reliability evaluation of small diameter plated through holes in printed wiring boards . IPC-TR-579, 1988
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