Volume 33 Issue 03
Mar.  2007
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Ma Weimin, Jürgen Hesselbach, Huan Jiet al. Experiments on surface structure for micro assembly using adhesive bonding[J]. Journal of Beijing University of Aeronautics and Astronautics, 2007, 33(03): 361-365. (in Chinese)
Citation: Ma Weimin, Jürgen Hesselbach, Huan Jiet al. Experiments on surface structure for micro assembly using adhesive bonding[J]. Journal of Beijing University of Aeronautics and Astronautics, 2007, 33(03): 361-365. (in Chinese)

Experiments on surface structure for micro assembly using adhesive bonding

  • Received Date: 18 Apr 2006
  • Publish Date: 31 Mar 2007
  • Micro adhesive bonding technology shows great potential in the assembly of micro-electro-mechanical system(MEMS) products. The quality of micro assembly using adhesive bonding is sensitive to two factors:the fluctuation of the adhesive volumes and the spread of the meniscus.In order to solve this problem, two surface structures on the bonding area were experimentally studied,which were the groove structure and meniscus-self-centering structure. Experiment results show that, the former structure has the ability of "fault-tolerance" to the volume of meniscus, and can overcome the influence of the mentioned factors on the quality of micro adhesive bonding; the latter structure enables meniscus to spread itself to the center of the groove, and thus to weaken the influence of the position error of micro assembly system. The two studied surface structures can be applied into the assembly of general MEMS products.

     

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