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Volume 32 Issue 10
Oct.  2006
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Journal of Beijing University of Aeronautics and Astronautics  > 2006  >  32(10): 1193-1198.
Shen Zhigang, Yu Xiaozheng, Xu Zheng, et al. Plating metal film on the surface of particles using magnetron sputtering method[J]. Journal of Beijing University of Aeronautics and Astronautics, 2006, 32(10): 1193-1198. (in Chinese)
Citation: Shen Zhigang, Yu Xiaozheng, Xu Zheng, et al. Plating metal film on the surface of particles using magnetron sputtering method[J]. Journal of Beijing University of Aeronautics and Astronautics, 2006, 32(10): 1193-1198. (in Chinese)
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Plating metal film on the surface of particles using magnetron sputtering method

  • 1.

    School of Aeronautic Science and Technology, Beijing University of Aeronautics and Astronautics, Beijing 100083, China

  • 2. General Research Institute for Non-ferrous Metals, Beijing 100088, China

  • Received Date: 22 May 2006
  • Publish Date: 31 Oct 2006
    Abstract
  • The metal copper and nickel film was deposited on particles by direct current magnetron sputtering method under different working conditions. The surface morphology, film thickness, chemical composition, film grain size as well as the film crystallization of particles were analyzed by optical microscope (OM), field emission scanning electron microscopy (FESEM), energy dispersive spectroscopy (EDS), multimode scanning probe microscope (SPM),inductively coupled plasma-atom emission spectrometer (ICP-AES), X-ray photoelectron spectroscopic (XPS) and X-ray diffraction (XRD) respectively before and after the plating process. The effects of different sputtering conditions on crystallization of metal films deposited on particles were discussed. The results indicate that the relatively uniform, compact and adhesive metal films were successfully deposited on particles through controlling the motion mode of particles during the sputter deposition. With the increasing of sputtering time or the increasing of sputtering power or the decreasing of the particle loading amount, both crystallization and grain size of metal film were improved.

     

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  • [1] Ohring M. Materials science of thin films[M]. New York:Academic Press,2002 [2] Akesson J, Seal S, Shukla S, et al. Copper plating process control by SEM[J]. Adv Mater Processes, 2002, 160(2):33-35 [3] Cai Chujiang, Shen Zhigang, Wang Mingzhu, et al. Surface metallization of cenospheres and precipitators by electroless plating[J].China Particuology,2003,1(4):156-161 [4] Shukla S, Seal S, Akesson J. Study of mechanism of electroless copper coating of fly ash cenosphere particles[J].Applied Surface Sciense,2001,182:35-50 [5] Chung W S, Chang S Y, Lin S J. Electroless nickel plating on SiC powder with hypophosphite as a reducing agent[J]. Plating & Surface Finishing, 1996,3:68-71 [6] Haieh S H, Yang T J. Study of the composite coating of SiC particles dispersed in an electroless nickel matmrix[J]. Key Engineering Materials, 2003, 249:195-198 [7] Chen C K, Feng H M, Lin H C. The effect of heat treatment on the microstructure of electroless Ni-P coatings containing SiC particles[J]. Thin Solid Films, 2002, 11(416):31-37
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