FOG ring modules thermal analysis based on thermoelectric analogy

For the fiber-optic gyroscope (FOG) was easily influenced by the ambient temperature resulting Shupe bias, the thermoelectric analogy method was applied to do the thermal analysis of different structural fiber optic ring (FOR) modules. The principle that the parallel heat capacity and series resistance were the key factor on the FOG thermal performance was proposed by comparing the corresponding circuit model. The parallel heat capacity and series resistance affecting the FOG temperature qualitatively was analyzed and the correctness of the circuit model was verified via finite element thermal simulation. In the same condition with the thermal simulation, the FOR temperature was associated with the FOG output performance after a temperature test cabinet experiment. The results show that increasing the parallel heat capacity and series resistance in FOR modules can reduce the ambient temperature effect on the FOR. Especially, the larger heat capacity can effectively reduce the FOR temperature change rate, thereby reducing the Shupe bias and improving the FOG thermal performance.