Volume 52 Issue 10
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Qian M F,Yin Z,Wang G S,et al. Progress in design and optimization of wide-temperature-range superelastic shape memory alloys[J]. Journal of Beijing University of Aeronautics and Astronautics,2026,52(10):3313-3328 (in Chinese)
Citation: Qian M F,Yin Z,Wang G S,et al. Progress in design and optimization of wide-temperature-range superelastic shape memory alloys[J]. Journal of Beijing University of Aeronautics and Astronautics,2026,52(10):3313-3328 (in Chinese)

Progress in design and optimization of wide-temperature-range superelastic shape memory alloys

doi: 10.13700/j.bh.1001-5965.2025.0565
Funds:

National Key Research and Development Program of China (2022YFB3805701); National Natural Science Foundation of China (52371182,51701052); Heilongjiang Provincial Natural Science Foundation of China (YQ2024E014); Heilongjiang Touyan Innovation Team Program

More Information
  • Corresponding author: E-mail:xxzhang@hit.edu.cn
  • Received Date: 13 Aug 2025
  • Accepted Date: 24 Oct 2025
  • Available Online: 05 Nov 2025
  • Publish Date: 30 Oct 2025
  • Superelasticity is one of the most important functional characteristics of shape memory alloys, which essentially originates from stress-induced reversible thermoelastic martensitic transformation. The superelastic working temperature range is mainly influenced by the synergistic effect of alloy chemical composition and microstructure. The development status of several shape memory alloy systems with broad temperature range superelastic properties over the last ten years is methodically reviewed in this article, with an emphasis on contrasting the features and variations of various alloys in important performance parameters like recoverable strain, temperature dependence of critical stress, and superelastic temperature window. This article uses comparative analysis to support the design, preparation, and engineering application of novel wide-temperature-range superelastic shape memory alloys theoretically and practically, as well as to offer opportunities for the field's future development.

     

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