Volume 33 Issue 05
May  2007
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Su Donglin, Wang Xiaoxiao. Relationship between PCB material and power/ground impedance[J]. Journal of Beijing University of Aeronautics and Astronautics, 2007, 33(05): 568-571. (in Chinese)
Citation: Su Donglin, Wang Xiaoxiao. Relationship between PCB material and power/ground impedance[J]. Journal of Beijing University of Aeronautics and Astronautics, 2007, 33(05): 568-571. (in Chinese)

Relationship between PCB material and power/ground impedance

  • Received Date: 06 Jul 2006
  • Publish Date: 31 May 2007
  • To mitigate PCB(printed circuit board) power/ground impedance, which is a great negative influential factor to signal and power integrity of high-speed multilayer PCB , the relation functions among PCB power/ground resonant impedance,resonant frequency, resonant quality factor and the electromagnetic parameters of power/ground planes structure were deducted based on cavity resonant model. According to the deductions above, two main ways to reduce PCB power/ground resonant impedance from the aspect of selecting conductive and insulating materials whose electromagnetic parameters are more helpful to reduce power/ground impedance were developed. These two ways include using conductive material with high permeability and low conductivity and adopting insulating material with high permittivity and loss tangent. The latter full-wave simulation results prove the effectiveness these two ways.

     

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  • [1] Xu M, Hubing T H. Estimating the power bus impedance of printed circuit boards with embedded capacitance [J]. IEEE Trans Adv Packag, 2002, 25(3):274-283 [2] Novak I. Reducing simultaneous switching noise and EMI on ground /power planes by dissipative edge termination [J]. IEEE Trans Adv Packag, 1999, 22(3):274-283 [3] Novak I, Noujeim L M, Cyr V St, et al. Distributed matched bypassing for board-level power distribution networks[J]. IEEE Trans Adv Packag, 2002, 25(2):230-243 [4] Pozar D M. Microwave engineering [M]. New York:Wiley, 1997 [5] Okoshi T. Planar circuits for microwaves and light waves [M]. Minich,Germany:Springer-Verlag, 1985:10-42 [6] Wu L K, Tseng C H. A theoritical investigation of the resonance damping performance of magnetic material coating in power/ground plane structures [J]. IEEE Trans,Electromagnetic Compatibility,2005, 47(2):731-737
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