薄板激光弯曲温度场的数值模拟与校验

王秀凤; 吕晓东; 胡世光; 陈光南

薄板激光弯曲温度场的数值模拟与校验

1.
北京航空航天大学机械工程及自动化学院
2. 中国科学院力学所

基金项目: 国家自然科学基金资助项目(59836220); 航空基础科学基金资助项目(98H51110)

详细信息

作者简介:
王秀凤 (1963-),女,北京人,副教授,100083,北京.

中图分类号: TN 249; TG 386.3⁺1
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- 文章访问数: 2489
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- 被引次数: 0
出版历程
- 收稿日期: 2001-09-10
- 网络出版日期: 2003-05-31

Simulation and Verification of the Temperature Field in Laser Bending Sheet Metal

1.
School of Mechanical Engineering and Automation, Beijing University of Aeronautics and Astronautics
2. Institute of Mechanics, Chinese Academy of Science

摘要

摘要: 采用MSC.Marc非线性有限元软件,对薄板激光弯曲过程中的温度场进行了数值模拟 ,得到了引起薄板激光弯曲变形的温度场的变化规律.通过温度传感器测量与激光扫描线相对应的薄板下表面温度变化的规律来验证数值模拟的结果.模拟值与实测值基本吻合,表明数值模拟结果可作为激光加工工艺参数选择的依据.
- 薄板 /
- 激光弯曲 /
- 温度场 /
- 数值模拟
Abstract: Temperature field in the laser bending process was numerically simulated by MSC. Marc software. Variations of temperature with time to cause sheet metal bending were calculated. Simulation result was verified by the temperature on the lower surface of the sheet metal, which was measured by the thermocouple temperature t ransducer measuring under the laser scanning line. Experimental curves of temper ature versus time are in agreement with simulation results. The simulation resul ts can be regarded as a basis for choosing laser technological parameters.
- thin plates /
- laser bending /
- temperature field /
- numerical simulation

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参考文献(1)

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