FiniteElement Analysis of Temperature Field of PCB and Components
-
摘要: 首先简要介绍了一下热传输原理,而后应用有限元探索了双列直插式元件及印制电路板(PCB)的二维和三维稳态热传输,通过计算实例的温度场分布对两种方式作比较,并通过点测进行实验研究,计算与实验测量相吻合,给出结论, 有限元三维模拟比二维模拟更为复杂,但得到的信息更为详细.Abstract: Heat transfer was introduced. The finite-element method (FEM) is used to investigate steady-state two and three-dimensional heat transfer in dual-in-line component and PCB. Two methods are compared through real examples' temperature distribution. And experiments with point test method are done to compare with the results of calculated and results are much in accord with each other. Conclusion is also given that three-dimensional finite-element method is more complex and with it more particular messages could be obtained.
-
Key words:
- finite elements /
- temperature field /
- electronic components /
- PCB
-
[1] Hardisty H,Abboud J.Thermal analysis of a dual-in-line package using the finite-element method[J].IEE proceedings, 1987, 134 PtⅠ(1):675~684. [2]Swager Anne Watson.Thermal images provide reliability clues[J].EDN,1990(1):47,49,50,52,54,56,58. [3]杜则裕,刘继元.工程材料简明手册[M].北京:电子工业出版社, 1995. [4]Ellison Gordon N.Extensions of the closed from method for substrate thermal analyzers to include thermal resistances from source-to-substrate and source-to-ambient[J].IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992,15(5):658~666. [5]John N Funk,Menguc M Pinar, Kaveh A Tagavi,et al.A semi-analytical method to predict printed circuit board package temperatures. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992,15(5):675~684. [6]William M Godfrey, Kaveh A Tagavi, Clifford J Cremers,et al.Interactive thermal modeling of electronic circuit boards[J].IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1993,16(8):978~985. -
点击查看大图
计量
- 文章访问数: 2415
- HTML全文浏览量: 67
- PDF下载量: 1125
- 被引次数: 0
下载:
