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移动电子设备相变热控单元热性能的数值仿真

吴斌 邢玉明

吴斌, 邢玉明. 移动电子设备相变热控单元热性能的数值仿真[J]. 北京航空航天大学学报, 2010, 36(11): 1330-1334.
引用本文: 吴斌, 邢玉明. 移动电子设备相变热控单元热性能的数值仿真[J]. 北京航空航天大学学报, 2010, 36(11): 1330-1334.
Wu Bin, Xing Yuming. Numerical investigation of phase change thermal control unit for portable electronic devices[J]. Journal of Beijing University of Aeronautics and Astronautics, 2010, 36(11): 1330-1334. (in Chinese)
Citation: Wu Bin, Xing Yuming. Numerical investigation of phase change thermal control unit for portable electronic devices[J]. Journal of Beijing University of Aeronautics and Astronautics, 2010, 36(11): 1330-1334. (in Chinese)

移动电子设备相变热控单元热性能的数值仿真

基金项目: 国家自然科学基金资助项目(50876004)
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    通讯作者:

    吴斌

  • 中图分类号: TK512+.4

Numerical investigation of phase change thermal control unit for portable electronic devices

More Information
    Corresponding author: Wu Bin
  • 摘要: 采用相变材料(PCM,Phase Change Material)的热控制单元(TCU,Thermal Control Unit)可以很好地实现对可移动电子设备的热控制,避免设备过热而引起的热故障.建立了分析TCU热性能的二维数学模型,并进行了数值计算.结果表明:加肋和填充泡沫-PCM复合材料的设计方案可以显著提高TCU热性能,能很好地满足电子元件的工作要求.此外,还对加肋和填充泡沫-PCM提高TCU性能的效果进行了比较,结果表明:填充泡沫-PCM复合材料的方案更具优势.所得结论对移动电子设备TCU的设计和优化有一定的指导作用.

     

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出版历程
  • 收稿日期:  2009-10-26
  • 网络出版日期:  2010-11-30

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