纳米银膏与微米银膏烧结连接对比

朱颖; 唐善平; 闫剑锋; 邹贵生

纳米银膏与微米银膏烧结连接对比

1.
北京航空航天大学机械工程及自动化学院, 北京 100191
2. 清华大学机械工程系, 北京 100084

基金项目: 国家自然科学基金资助项目(51075232)

详细信息

中图分类号: TB 31
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出版历程
- 收稿日期: 2012-05-14
- 网络出版日期: 2013-04-30

Comparation of the bonding through sintering between Ag nanoparticle paste and Ag microparticle paste

1.
School of Mechanical Engineering and Automation, Beijing University of Aeronautics and Astronautics, Beijing 100191, China
2. Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China

摘要

摘要: 用粒径20~80nm的纳米银膏和粒径1~3μm的微米银膏进行了烧结连接镀银铜块的对比实验.借助热/力物理模拟试验机Gleeble 1500D对接头剪切强度进行了测定.用扫描电镜及能谱分析仪对接头的微观组织进行了观察和分析.结果表明:在相同的连接条件下纳米银膏烧结连接的剪切强度明显高于微米银膏烧结连接的剪切强度.接头断口和显微组织分析表明,在相同条件下,纳米银膏烧结接头组织的质密性好于微米银膏烧结接头的组织质密性.在微米银连接接头中,由于Cu块-烧结银层间的界面处存在裂纹,其剪切强度较低.
- 纳米银膏 /
- 电子封装 /
- 无铅 /
- 烧结
Abstract: The Ag nanoparticle paste with diameter of 20~80nm and the Ag microparticle paste with diameter of 1~3μm were used to bond Ag coated Cu discs. The shear strength was evaluated using the physical simulators Gleeble 1500D. Microstructure of the joint was studied with scanning electron microscope (SEM) and energy dispersive spectroscopy (EDS). The result shows that the shear strength of the joint using Ag nanoparticle paste is significantly higher than that of joints with Ag microparticle paste at the same parameter. The analysis of the fracture surface and interfacial of joint shows that the joint bonded with Ag nanoparticle has higher sintering density than that of Ag microparticle. In the joint bonded with Ag microparticle, there were cracks at interfacial between the copper disc and sintered silver layer, which may contribute to the low shear strength.
- Ag nanoparticle paste /
- electronic packaging /
- lead-free /
- sintering

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参考文献(15)

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