金合金锡铅软钎焊接头脆性行为

尹娜; 曲文卿; 杨淑娟; 李睿

金合金锡铅软钎焊接头脆性行为

1.
北京航空航天大学机械工程及自动化学院, 北京 100191
2. 北京控制工程研究所, 北京 100080

详细信息

中图分类号: V252.3
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出版历程
- 收稿日期: 2012-05-29
- 修回日期: 2012-06-29
- 网络出版日期: 2013-05-31

Brittle behavior of gold alloy joint soldered with tin-lead solder

1.
School of Mechanical Engineering and Automation, Beijing University of Aeronautics and Astronautics, Beijing 100191, China
2. Beijing Institute of Control Engineering, Beijing 100080, China

摘要

摘要: 采用Sn63Pb37钎料对Au60AgCu合金进行钎焊试验.对钎焊接头的微观组织、显微硬度、化合物相成分、力学性能及断口形貌进行了分析,并探讨了界面化合物相对接头脆性的影响.结果表明:Au60AgCu合金接头化合物主要由AuSn₂,AuSn₄和Ag₃Sn组成.金属间化合物的硬度很高,其厚度随钎焊温度的升高及保温时间的增长而增厚.钎焊接头剪切性能测试表明,断裂发生在金属间化合物层,断口形貌为脆性断裂.
- Au60AgCu合金 /
- 锡铅钎料 /
- 金属间化合物 /
- 脆性断裂
Abstract: Soldering of Au60AgCu using tin-lead solder was performed in the experiment. The soldering joint of microstructure, micro-hardness, phase composition, mechanical properties and fracture morphology were analyzed, and the effect of interface intermetallic compound on joint brittleness was discussed. It was found that the compound of Au60AgCu alloy soldering joint was composed of AuSn₂, Ag₃Sn and AuSn₄. With increasing the soldering temperature and/or time, the thickness of intermetallic compound was obviously increased. The hardness of intermetallic compound was high. The soldering joint of shear mechanical property test indicates that fracture occurred in the intermetallic compound layer, and the fracture morphology is brittle fracture.
- Au60AgCu alloy /
- tin-lead solder /
- intermetallic compound /
- brittle fracture

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参考文献(8)

[1]	衣伟,毛书勤.圆柱式通孔导电环装配工艺技术[J].电子工艺技术,2010,31(9):293-295 Yi Wei,Mao Shuqin.Assemble technics of column through hole rotation slip-ring[J].Electronics Process Technology,2010,31(9):293-295(in Chinese)
[2]	张会林,张凤山.精密导电环在高速高温真空环境中输电特性研究[J].红外与毫米波学报,2003,22(6):461-463 Zhang Huilin,Zhang Fengshan.Electric transportation properties of the high speed rotation exact electric ring under high temperature and vacuum environment[J].Infrared Millim Waves,2003,22(6):461-463(in Chinese)
[3]	Roopnarine.A flexible band/geared planetary device for electrical transmissions across continuously rotating Joints[R].AIAA-94-4460,1994
[4]	Chang C W,Ho C E,Yang S C,et al.Kinetics of AuSn₄ migration in lead-free solders[J].Journal of Electronic Materials,2006,35(11):1948-1954
[5]	Peng S P,Wu W H,Ho C E,et al.Comparative study between Sn37Pb and Sn3Ag0.5Cu soldering with Au/Pd/Ni (P) tri-layer structure[J].Journal of Alloys and Compounds,2010,437:431-437
[6]	Vivek Chidambaram,John Hald,Jesper Hattel.Development of Au-Ge based candidate alloys as an alternative to highdlead content solders[J].Journal of Alloys and Compounds,2010,490:170-179
[7]	Wu W H,Lin C S,Huang S H,et al.Influence of palladium thickness on the soldering reactions between Sn-3Ag-0.5Cu and Au/Pd(P)/Ni(P) surface finish[J].Journal of Electronic Materials,2010,39(11):2387-2396
[8]	Chang C W,Ho C E,Yang S C,et al.Kinetics of AuSn4 migration in lead-free solders[J].Journal of Electronic Materials,2006,35(11):1948-1954