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改进的内框架驱动式硅MEMS陀螺温度误差模型

房建成 李建利 盛蔚

房建成, 李建利, 盛蔚等 . 改进的内框架驱动式硅MEMS陀螺温度误差模型[J]. 北京航空航天大学学报, 2006, 32(11): 1277-1280.
引用本文: 房建成, 李建利, 盛蔚等 . 改进的内框架驱动式硅MEMS陀螺温度误差模型[J]. 北京航空航天大学学报, 2006, 32(11): 1277-1280.
Fang Jiancheng, Li Jianli, Sheng Weiet al. Improved temperature error model of silicon MEMS gyroscope with inside frame driving[J]. Journal of Beijing University of Aeronautics and Astronautics, 2006, 32(11): 1277-1280. (in Chinese)
Citation: Fang Jiancheng, Li Jianli, Sheng Weiet al. Improved temperature error model of silicon MEMS gyroscope with inside frame driving[J]. Journal of Beijing University of Aeronautics and Astronautics, 2006, 32(11): 1277-1280. (in Chinese)

改进的内框架驱动式硅MEMS陀螺温度误差模型

基金项目: 国防基础科研基金资助项目(k1204060116); 新世纪优秀人才支持计划资助项目(NCET-04-0162)
详细信息
    作者简介:

    房建成(1965-),男,山东临沂人,教授,fangjiancheng@buaa.edu.cn.

  • 中图分类号: U 666.1; V 241.6

Improved temperature error model of silicon MEMS gyroscope with inside frame driving

  • 摘要: 温度误差是MEMS(Micro Electronic Mechanical System)陀螺仪的主要误差源之一,为了消除温度对内框架驱动式硅MEMS陀螺仪性能的影响,提出了一种改进的温度误差模型.基于硅材料的赛贝克(Seebeek)效应,结合表头温度变形,分析了陀螺仪零偏误差;利用温度引起的干扰力矩,分析了陀螺仪输出与比力及角加速度有关项误差;针对温度引起系统谐振频率的变化,分析了陀螺仪标度因数误差.试验结果表明:在温度变化过程中,比力引起的干扰力矩是导致陀螺仪温度误差的主要因素,验证了改进的温度误差模型的正确性,补偿后陀螺仪的零偏稳定性提高了53.75倍,标度因数精度提高了19.6倍,改进的温度误差模型也适用于其它MEMS陀螺仪.

     

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出版历程
  • 收稿日期:  2006-04-30
  • 网络出版日期:  2006-11-30

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