留言板

尊敬的读者、作者、审稿人, 关于本刊的投稿、审稿、编辑和出版的任何问题, 您可以本页添加留言。我们将尽快给您答复。谢谢您的支持!

姓名
邮箱
手机号码
标题
留言内容
验证码

星载电子器件用空气射流散热特性

刘亮堂 王安良

刘亮堂, 王安良. 星载电子器件用空气射流散热特性[J]. 北京航空航天大学学报, 2015, 41(8): 1553-1559. doi: 10.13700/j.bh.1001-5965.2014.0596
引用本文: 刘亮堂, 王安良. 星载电子器件用空气射流散热特性[J]. 北京航空航天大学学报, 2015, 41(8): 1553-1559. doi: 10.13700/j.bh.1001-5965.2014.0596
LIU Liangtang, WANG Anliang. Characteristic of air jet impingement cooling performance for electronic equipment of satellite[J]. Journal of Beijing University of Aeronautics and Astronautics, 2015, 41(8): 1553-1559. doi: 10.13700/j.bh.1001-5965.2014.0596(in Chinese)
Citation: LIU Liangtang, WANG Anliang. Characteristic of air jet impingement cooling performance for electronic equipment of satellite[J]. Journal of Beijing University of Aeronautics and Astronautics, 2015, 41(8): 1553-1559. doi: 10.13700/j.bh.1001-5965.2014.0596(in Chinese)

星载电子器件用空气射流散热特性

doi: 10.13700/j.bh.1001-5965.2014.0596
详细信息
    作者简介:

    刘亮堂(1989-),男,硕士研究生,河南商丘人,liangtangliu@163.com

    通讯作者:

    王安良(1974-),男,讲师,山西新绛人,wanganliang@buaa.edu.cn,主要研究方向为工程热物理和卫星热控技术.

  • 中图分类号: V444.3

Characteristic of air jet impingement cooling performance for electronic equipment of satellite

  • 摘要: 在前期设计卫星大功率电子设备地面测试用通风散热系统的基础上,对系统散热性能进行了优化设计,对不同结构参数下电子器件的空气射流强化散热开展了数值仿真.研究结果表明系统中喷嘴出口直径、喷嘴出口至换热面距离、射流倾斜角以及喷嘴出口风速等参数对散热性能均有直接影响,并给出了定量的无量纲参数优化设计结果.该结论也可应用于表面热流密度为1 kW/m2级电子器件散热的优化设计,并为星载大功率电子设备对流式热控系统设计和地面测试提供技术参考.

     

  • [1] Wang A L, Liu L T,Zhao J F,et al.Thermal control system design for high power electronic equipment of satellite during ground tests[C]//International Heat Transfer Symposium, 2014.
    [2] 张加迅,李劲东. 气体循环热控技术在卫星热设计中的应用[J].宇航学报,2002,23(6):62-67. Zhang J X,Li J D.The application of thermal control system of gas cycle[J].Journal of Astronautics,2002,23(6):62-67(in Chinese).
    [3] Zu Y Q, Yan Y Y.Numerical study on stagnation point heat transfer by jet impingement in a confined narrow gap[J].Journal of Heat Transfer,2009,131(9):1-4.
    [4] Zhang Y, Fan J Y,Liu J.Numerical investigation based on CFD for air impingement heat transfer in electronics cooling[C]//2005 Conference on High Density Micro system Design and Packaging and Component Failure Analysis.Piscataway,NJ:IEEE Press,2005:1-5.
    [5] Yang Y T, Wei T C,Wang Y H.Numerical study of turbulent slot jet impingement cooling on a semi-circular concave surface[J].International Journal of Heat and Mass Transfer,2010,54(1-3):482-489.
    [6] Huang C H, Chen Y H,Li H Y.An impingement heat sink module design problem in determining optimal non-uniform fin widths[J].International Journal of Heat and Mass Transfer,2013,67:992-1006.
    [7] Huang C H, Chen Y H.An impingement heat sink module design problem in determining simultaneously the optimal non-uniform fin widths and heights[J].International Journal of Heat and Mass Transfer,2014,73:627-633.
    [8] Yang Y T, Lin S C,Wang Y H.Numerical simulation and optimization of impingement cooling for rotating and stationary pin-fin heat sinks[J].International Journal of Heat and Fluid Flow,2013,44:383-393.
    [9] Maveety J G, Jung H H.Design of an optimal pin-fin heat sink with air impingement cooling[J].International Communications in Heat and Mass Transfer,2000,27(2):229-240.
    [10] 涂福炳,周孑民, 曾文辉.空气冲击射流下柱鳍热沉散热特性实验研究[J].湖南科技大学学报:自然科学版,2008,23(2):41-46. Tu F B,Zhou J M,Zeng W H.Experiment study on characteristic of air jet impingement cooling system for pin fin heat sink[J].Journal of Hunan University of Science and Technology:Natural Science Edition,2008,23(2):41-46(in Chinese).
    [11] Martin H. Heat and mass transfer between impinging gas jets and solid surfaces[J].Advances in Heat Transfer,1977,8(13):1-60.
    [12] 顾维藻. 强化传热[M].北京:科学出版社,1990:189-208. Gu W Z.Heat transfer enhance[M].Beijing:Science Press,1990:189-208(in Chinese).
  • 加载中
计量
  • 文章访问数:  939
  • HTML全文浏览量:  141
  • PDF下载量:  561
  • 被引次数: 0
出版历程
  • 收稿日期:  2014-09-26
  • 网络出版日期:  2015-08-20

目录

    /

    返回文章
    返回
    常见问答