循环电载荷下大功率LED金引线疲劳断裂寿命预测

樊嘉杰; 李磊; 钱诚; 胡爱华; 樊学军; 张国旗

doi:10.13700/j.bh.1001-5965.2018.0401

循环电载荷下大功率LED金引线疲劳断裂寿命预测

doi: 10.13700/j.bh.1001-5965.2018.0401

樊嘉杰^{1, 2, ,},
李磊²,
钱诚³,
胡爱华⁴,
樊学军⁵,
张国旗⁶

1.
河海大学机电工程学院, 常州 213022
2.
常州市武进区半导体照明应用技术研究院, 常州 213161
3.
北京航空航天大学可靠性与系统工程学院, 北京 100083
4.
福建鸿博光电科技有限公司, 福州 350008
5.
美国拉玛尔大学机械工程系, 博蒙特 77710
6.
荷兰代尔夫特理工大学 EEMCS学院, 代尔夫特 2628

基金项目:

国家自然科学基金 51805147

国家自然科学基金 61673037

江苏省"六大人才高峰"高层次人才项目 GDZB-017

中央高校基本科研业务费专项资金 2017B15014

国家国际科技合作专项 2015DFT10110

详细信息

作者简介:
樊嘉杰男, 博士, 副教授, 硕士生导师。主要研究方向:机械电子器件及系统故障诊断和预测、半导体照明系统可靠性评估、第三代半导体封装及组装工艺等

通讯作者:
樊嘉杰, E-mail:jiajie.fan@hhu.edu.cn

中图分类号: TN312.8
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出版历程
- 收稿日期: 2018-07-02
- 录用日期: 2018-10-15
- 网络出版日期: 2019-03-20

Fatigue fracture lifetime prediction for gold bonding wires of high-power LED under cyclically electrical loading

FAN Jiajie^{1, 2
, ,},
LI Lei²,
QIAN Cheng³,
HU Aihua⁴,
FAN Xuejun⁵,
ZHANG Guoqi⁶

1.
College of Mechanical and Electrical Engineering, Hohai University, Changzhou 213022
2.
Changzhou Institute of Technology Research for Solid State Lighting, Changzhou 213161, China
3.
School of Reliability and Systems Engineering, Beihang University, Beijing 100083, China
4.
Fujian Hongbo Opto-Electronics Technology Co., Ltd., Fuzhou 350008, China
5.
Department of Mechanical Engineering, Lamar University, Beaumont 77710, USA
6.
EEMCS Faculty, Delft University of Technology, Delft 2628, Netherlands

Funds:

National Natural Science Foundation of China 51805147

National Natural Science Foundation of China 61673037

the Six Talent Peaks Project of Jiangsu Province, China GDZB-017

the Fundamental Research Funds for the Central Universities 2017B15014

International S & T Cooperation Program of China 2015DFT10110

More Information

Corresponding author: FAN Jiajie, E-mail:jiajie.fan@hhu.edu.cn

摘要

摘要:
随着大功率发光二极管（LED）在照明领域的普及与广泛应用，可靠性逐渐成为研究的重点。大功率LED封装器件中金引线疲劳断裂失效一直是制约其可靠性的重要因素。通过针对大功率LED封装器件中的金引线力学仿真与功率循环试验相结合的方法，首先确定循环电载荷条件下该型LED的主要失效原因为金引线疲劳断裂，其次提出基于电流加速模型的加速因子提取方法和基于应变幅值的Coffin-Manson解析寿命预测方法，最终完成对LED金引线疲劳断裂寿命的预测和试验验证。研究结果表明：所提方法具有较高的寿命预测精度，可以满足大功率LED封装器件可靠性快速、准确评估的要求。
- 大功率发光二极管(LED) /
- 金引线 /
- 疲劳断裂 /
- 寿命预测 /
- 可靠性
Abstract:
With the popularity and widespread application of high-power light-emitting diode (LED) in lighting industry, its reliability has gradually become one of research focuses.The failure of gold bonding wires in the traditional LED package has been a critical bottleneck that restricts its reliability. In this paper, the failure mechanism of LED under cyclically electrical loading is firstly identified through both gold bonding wire mechanical simulation and power cycling test experiment, which is the fatigue fracture of gold bonding wire. Then, two lifetime prediction methods, the acceleration factor extraction method based on current acceleration model and the strain-based Coffin-Manson analytical method, are established and verified with experimental results. The results show that the lifetime prediction accuracy of the proposed methods is high and they can achieve a fast and accurate reliability assessment for high-power LEDs with wire-bonding packaging technology.
- high-power light-emitting diode (LED) /
- gold bonding wires /
- fatigue fracture /
- lifetime prediction /
- reliability

HTML全文

图 1 基于电压加速模型的加速因子提取

Figure 1. Extracted acceleration factors based on voltage acceleration model

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图 2 本文所选大功率LED样品

Figure 2. High-power LEDs used in this paper

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图 3 LED功率循环老化试验平台装置图

Figure 3. Power cycling aging test platform for LEDs

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图 4 大功率LED的仿真模型

Figure 4. Simulation model of high-power LED

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图 5 功率循环载荷示意图

Figure 5. Schematic of power cycling loading

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图 6 功率循环测试后金引线的von Mises应力仿真分布

Figure 6. Simulated von Mises stress distribution of gold bonding wire after power cycling test

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图 7 功率循环测试后LED失效样品图

Figure 7. Failed LED sample after power cycling test

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图 8 不同电流条件下金引线的塑性应变变化过程

Figure 8. Changing process of plastic strain of gold bonding wire under different current conditions

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表 1 三种正向电流条件下的测试结果

Table 1. Test results under conditions of three forward currents

正向电流I/mA	器件内阻R_S/Ω	压力反向饱和电流I_s1/(10^-9A)	参考反向饱和电流I_s0/(10^-10A)	理想因子n
800	4.78	1.4	2	2.67
900	4.37	2.3	2	2.67
1000	4.04	2.9	2	2.67

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表 2 加速寿命测量结果和预测结果对比

Table 2. Comparison of accelerated lifetime testing results and prediction results

正向电流/mA	63%平均失效时间/h	加速因子	预测寿命/h	700mA试验寿命/h	绝对误差/%
800	400	4.65	1860	1765	5.38
900	82	21.24	1742	1765	1.30
1000	26	68.31	1776	1765	0.62

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表 3 基于仿真的金引线疲劳寿命预测结果

Table 3. Gold bonding wire fatigue lifetime prediction results based on simulations

电流/mA	应变幅	实测寿命/h	预测寿命/h	误差/%
700	0.000590	1765	1887	6.912
800	0.000667	400
900	0.000757	82
1000	0.000840	26

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