Thermal control design and verification for high resolution stereo mapping camera system
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摘要:
高分辨率立体测绘相机的光学系统及探测器的温度稳定性影响测绘相机的测绘精度。针对透射式光学系统，采用多级外热流抑制技术，使星相机透镜的温度稳定性提高了6倍；针对反射式光学系统，采用间接辐射式控温等热控技术，使主镜、次镜的温度稳定性达到±0.3 ℃；针对大功率电荷耦合元件（CCD），采用基于环路热管（LHP）的节能型控温技术，在满足温度指标的前提下使环路热管驱动功率的周期平均值由60 W降低至33.8 W，同时节省约40%的主冷凝器面积及质量；针对CMOS，采用两级温度波动抑制技术，使其温度稳定性达到±0.3 ℃。研究了地面热试验的方法，报告了测绘相机系统关键部组件在极端空间环境下的在轨数据，全面验证了热控设计方法的正确性。
Abstract:The temperature stability of optical system and detector of high precision stereo mapping camera affects the mapping accuracy of mapping camera. For transmission optical system, multi-stage external heat flow suppression technology is adopted to improve the temperature stability of the star camera lens by 6 times; for reflective optical system, thermal control technologies such as indirect radiation temperature control are adopted to make the temperature stability of the primary and secondary mirrors reach ±0.3 ℃; for high-power charge-coupled device (CCD), energy-saving temperature control technology based on loop heat pipe (LHP) is adopted to make the LHP driving power cycle average from 60 W to 33.8 W, while saving about 40% of the primary condenser area and mass; for CMOS, using two-stage temperature fluctuation suppression technology, the temperature stability is ±0.3 ℃. The method of ground thermal test was investigated, and the flight temperature data of key components of the mapping camera system under extreme space environment were reported, which fully verified the correctness of the thermal control design method.
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图 1 高分辨率立体测绘相机系统组成框图
Figure 1. Component schematic diagram of high resolution stereo mapping camera system
图 2 前视地相机焦面组件示意图
Figure 2. Component schematic diagram of front earth camera focal plane assemble
图 8 第1片和最后1片CCD冷板温度曲线
Figure 8. Temperature curves of the first and the last CCD cold plate
图 12 遮阳罩仿真与试验温度对比
Figure 12. Temperature comparison between simulation and test results
图 13 星相机CMOS探测器控温原理
Figure 13. Schematic diagram of star camera CMOS detector thermal control
图 15 激光测距分系统光学元件控温区域
Figure 15. Thermal control zone of laser altimeter subsystem optical element
图 16 高分辨率主体测绘相机系统热平衡试验照片
Figure 16. Picture of thermal balance test of high resolution stereo mapping camera system
图 17 前视、后视LHP启动过程温度曲线
Figure 17. Temperature curves of each part in LHP startup process of front and back earth camera
图 18 主框架在外热流极端情况下的温度曲线
Figure 18. Temperature curves of main structure at extreme external heat flux
图 19 地相机镜头在外热流极端情况下的温度曲线
Figure 19. Temperature curves for lens of earth camera at extreme external heat flux
图 20 地相机CCD在外热流极端情况下的温度曲线
Figure 20. Temperature curves for CCDs of earth camera at extreme external heat flux
图 21 星相机镜头在外热流极端情况下的温度曲线
Figure 21. Temperature curves for lens of star camera at extreme external heat flux
图 22 星相机CMOS在外热流极端情况下的温度曲线
Figure 22. Temperature curves for CMOS of star camera at extreme external heat flux
图 23 激光测距仪光学镜头在外热流极端情况下的温度曲线
Figure 23. Temperature curves fore lens of laser altimeter at extreme external heat flux
图 24 激光测距仪热源在极端外热流情况下的温度曲线
Figure 24. Temperature curves for heat source of laser altimeter at extreme external heat flux
表 1 测绘相机热源工作模式与热耗
Table 1. Operating mode and heat consumption of mapping camera heat source
分系统 部组件 单个部组件热耗/W 工作模式/（min·轨−1） 测绘相机 前视CCD 3 8 前视焦面电路 9 8 后视CCD 9 8 后视焦面电路 21 8 坐标测量 星相机CMOS 1 8 星相机焦面电路 36 15 光轴位置记录器 7 15 激光测距 发射机LD阵列 3.7 16 发射机驱动源 67.1 16 接收机APD探测器 4 16 足印相机 30 16 
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表 2 各部组件温度指标
Table 2. Temperature requirements of each components
分系统 部组件 温度范围/℃ 在轨长期
温度波动/℃测绘相机 主框架 10~22 ±0.5 反射镜 18~22 ±0.25 主承力结构 18~22 ±0.25 CCD 18~22 电路盒 −20~30 坐标测量 星相机透镜 19~21 ±0.25 星相机CMOS 20~27 ±1 激光测距 发射镜头 17~21 发射机腔体 17~21 接收机主、次镜 17~21 APD探测器 14~24 足印镜头 17~21 足印焦面 17~21 主承力结构 14~24
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表 3 LHP主要特性参数
Table 3. Main characteristics of LHP
参数 工质
种类质量流量/
(g·s−1)蒸发器
加热功率/W储液器
加热功率/W预热器
加热功率/W前视主冷凝器
面积/m2前视副冷凝器
面积/m2后视主冷凝器
面积/m2后视副冷凝器
面积/m2数值 氨 0.05 60 15 15 0.27 0.20 0.38 0.32
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表 4 热平衡试验各部组件温度结果
Table 4. Temperature results of each component in thermal balance test
分系统 部组件 试验温度范围/℃ 测绘相机 主框架 16.0~16.3 反射镜 19.7~20.0 主承力结构 20.0~20.2 拼接基座 20.0~20.4 前视CCD 19.6~20.8 电路盒 15.2~19.3 坐标测量 透镜 19.7~20.2 星相机CMOS 21.2~21.8 电路盒 9.0~15.6 激光测距 发射镜头 19.3~20.2 发射机腔体 18.9~19.4 接收机主镜、次镜 19.7~20.2 APD探测器 15.8~20.9 足印镜头 18.2~19.2 足印焦面 18.5~19.6 主承力结构 18.4~19.1
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