电解铜箔材料中晶面择优取向

张世超; 蒋涛; 白致铭

电解铜箔材料中晶面择优取向

北京航空航天大学材料科学与工程学院北京 100083

基金项目: 国家863基金资助项目(2002AA302402)

详细信息

作者简介:
张世超(1963-),男,河南灵宝人,教授, CSC@buaa.edu.cn.

中图分类号: TQ 1531
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- 被引次数: 0
出版历程
- 收稿日期: 2004-04-28
- 网络出版日期: 2004-10-31

Preferred orientation of electrolytic copper foil

School of Materials Science and Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100083, China

摘要

摘要: 采用含有硫脲、明胶添加剂的硫酸盐电沉积体系,利用X射线衍射仪(XRD)、万能试验机等手段研究了不同电沉积条件下制备的铜箔材料的择优取向特征及其对铜箔机械性能的影响.结果表明,较大电流密度下,以硫脲为添加剂生产的电解铜箔出现(220)面择优取向,织构程度受到铜箔厚度、电流密度影响,最大织构系数TC(220)达到93.2％.此外,铜箔发生择优取向与添加剂有关,相同条件下,以骨胶为添加剂生产的电解铜箔未出现明显的择优取向特征.同时,铜箔表面并没有出现择优晶向,保证了铜箔沿平面方向上抗拉强度及延伸率的稳定.
- 电沉积 /
- 织构 /
- 铜箔
Abstract: Preferred orientation of copper foil which was electrodeposited under different conditions in electrolyte solution containing thioureas,glue additives was studied by X-ray diffraction(XRD), all-purpose material testing machine．The results showed that the copper foil which was electrodeposited in electrolyte solution containing thioureas has the character of preferential orientation (220),the extent of the texture was influenced by the thickness and current density．the peak of TC(220) was 93.2%．The kind of additives has influence on the texture．The foil produced in electrolyte solution containing glue has no evidently character of preferential orientation．The tensile strength and elongation paralleling the surface of the foil are at the same level in different orientation.
- electro-deposition /
- texture /
- copper foil

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参考文献(1)

[1] Lu L,Li S X ,Lu K．An abnormal strain rate effect on tensile behavior in nanocrystalline copper [J]．Scripta Materialia,2001,45:1163~1169 [2]Wang Y M,Wang K,Pan K,et al．Microsample tensile testing of nanocrystalline copper[J]．Scripta Materialia,2003,48:1581~1586 [3]Ma E．Instabilities and ductility of nanocrystalline and ultrafine-frained metals [J]．Scripta Materialia,2003,49:663~668 [4]Sanders P G,Youngdahl C J,Weertman J R．The strength of nanocrystalline metals with and without flaws [J]．Materials Science and Engineering,1997,A234~236:77~82 [5]Valiev R Z.Structure and mechanical properties of ultrafine-grained metals[J].Materials and Engineering,1997,A234-236:59~66 [6]Song H W, Guo S R．A coherent polycrystal model for the inverse hall-petch relation in nanocrystalline metals[J]．Nanostructured Materials,1999,11(2):203~210 [7]Kim H S, Estrin Y, Mark B, et al．Constitutive modeling of strength and plasticity of nanocrystalline metallic materials[J]．Materials Science and Engineering,2001,A316:195~199 [8]Wang Ning, Wang Zhirui,Aust K T,et al．Effect of grain size on mechanical properties of nanocrystalline materials[J]．Acta Metal Mater,1995,43(2):519~528 [9]Clouser．Electrodeposited copper foil ．USP5,454,926,1995 [10] Prengaman．Electrowinning anode ．USP6,131,798,2000 [11]Trasatti S．Electrocatalysis:understanding the success of DSA[J]．Electrochimica Acta,2000,(45):2377~2385 [12] 辜敏,杨防祖,黄令,等．高择优取向Cu电沉积层的XRD研究[J]．电化学,2002,8(3):282~287 Gu Min,Yang Fangzu,Huang Ling,et al．XRD study on highly preferred orientation Cu electrodeposit[J]．Electrochemistry,2002,8(3):282~287(in Chinese) [13] 周绍民.金属电沉积-原理与研究方法[M].上海:上海科学技术出版社,1987 Zhou Shaomin.Electrodeposition of metal-principle and methods[M].Shanghai:Shanghai Press of Science and Technology,1987(in Chinese)

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