纳米银膏与微米银膏烧结连接对比

朱颖; 唐善平; 闫剑锋; 邹贵生

纳米银膏与微米银膏烧结连接对比

1.
北京航空航天大学机械工程及自动化学院, 北京 100191
2. 清华大学机械工程系, 北京 100084

基金项目: 国家自然科学基金资助项目(51075232)

详细信息

中图分类号: TB 31
计量
- 文章访问数: 2210
- HTML全文浏览量: 170
- PDF下载量: 1644
- 被引次数: 0
出版历程
- 收稿日期: 2012-05-14
- 网络出版日期: 2013-04-30

Comparation of the bonding through sintering between Ag nanoparticle paste and Ag microparticle paste

1.
School of Mechanical Engineering and Automation, Beijing University of Aeronautics and Astronautics, Beijing 100191, China
2. Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China

摘要

摘要: 用粒径20~80nm的纳米银膏和粒径1~3μm的微米银膏进行了烧结连接镀银铜块的对比实验.借助热/力物理模拟试验机Gleeble 1500D对接头剪切强度进行了测定.用扫描电镜及能谱分析仪对接头的微观组织进行了观察和分析.结果表明:在相同的连接条件下纳米银膏烧结连接的剪切强度明显高于微米银膏烧结连接的剪切强度.接头断口和显微组织分析表明,在相同条件下,纳米银膏烧结接头组织的质密性好于微米银膏烧结接头的组织质密性.在微米银连接接头中,由于Cu块-烧结银层间的界面处存在裂纹,其剪切强度较低.
- 纳米银膏 /
- 电子封装 /
- 无铅 /
- 烧结
Abstract: The Ag nanoparticle paste with diameter of 20~80nm and the Ag microparticle paste with diameter of 1~3μm were used to bond Ag coated Cu discs. The shear strength was evaluated using the physical simulators Gleeble 1500D. Microstructure of the joint was studied with scanning electron microscope (SEM) and energy dispersive spectroscopy (EDS). The result shows that the shear strength of the joint using Ag nanoparticle paste is significantly higher than that of joints with Ag microparticle paste at the same parameter. The analysis of the fracture surface and interfacial of joint shows that the joint bonded with Ag nanoparticle has higher sintering density than that of Ag microparticle. In the joint bonded with Ag microparticle, there were cracks at interfacial between the copper disc and sintered silver layer, which may contribute to the low shear strength.
- Ag nanoparticle paste /
- electronic packaging /
- lead-free /
- sintering

HTML全文

参考文献(15)

[1]	朱笑鶤,娄浩焕,瞿欣,等.电子封装面临无铅化的挑战[J].电子与封装,2005,5(5):2-8 Zhu Xiaokun,Lou Haohuan,Qu Xin,et al.The challenge of changeover to lead-free in electronic packaging[J].Electronics & Packaging,2005,5(5):2-8(in Chinese)
[2]	安荣,刘威,杭春进,等.电子封装与组装焊点界面反应及微观组织研究进展[J].电子工艺技术,2011,32(6):321-325 An Rong,Liu Wei,Hang Chunjin,et al.Sn-based solder reaction and microstructure in electronic packaging and assembly[J].Electronics Process Technology,2011,32(6):321-325(in Chinese)
[3]	马良,尹力梦,冼健威,等.高温电子封装无铅化的研究进展[J].焊接技术,2009,38(5):6-10 Ma Liang,Yin Limeng,Xian Jianwei,et al.Research advancement of high temperature lead-free electronic packaging[J].Welding Technology,2009,38(5):6-10(in Chinese)
[4]	李聪,陈继兵,安兵,等.微连接焊点热循环可靠性的研究进展[J].电子工艺技术,2011,32(6):316-320 Li Cong,Chen Jibing,An Bing,et al.Review on reliability of micro-solder joints subjected to thermal cycling[J].Electronics Process Technology,2011,32(6):316-320(in Chinese)
[5]	邹贵生,闫剑锋,母凤文,等.微连接和纳连接的研究新进展[J].焊接学报,2011,32(4):107-112 Zou Guisheng,Yan Jianfeng,Mu Fengwen,et al.Recent progress in microjoining and nanojoining[J].Transactions of the China Welding Institution,2011,32(4):107-112(in Chinese)
[6]	杨艳,尹立孟,冼健威,等.绿色电子制造及绿色电子封装材料[J].电子工艺技术,2008,29(5):256-261 Yang Yan,Yin Limeng,Xian Jianwei,et al.Green manufacturing of electronics and materials for green electronic packaging[J].Electronics Process Technology,2008,29(5):256-261(in Chinese)
[7]	Morita Toshiaki,Ide Eiichi,Yasuda Yusuke,et al.Study of bonding technology using silver nanoparticles[J].Japanese Journal of Applied Physics,2008,47(8):6615-6622
[8]	Bufat Ph,Borel J P.Size effect on the melting temperature of gold particles[J].Physical Review A,1976,13(6):2287-2298
[9]	Minoru Maruyama,Ryo Matsubayashiet,Hiroaki Iwakuro,et al.Silver nanosintering:a lead-free alternative to soldering[J].Applied Physics A,2008(93):467-470
[10]	闫剑峰,邹贵生,李键,等.纳米银焊膏的烧结性能及其用于铜连接的研究[J].材料工程,2010(10):5-8 Yan Jianfeng,Zou Guisheng,Li Jian,et al.Study on the sintering characteristics and application in Cu bulk bonding of Ag-nanoparticle paste[J].Journal of Materials Engineering,2010(10):5-8(in Chinese)
[11]	齐昆.纳米银焊膏低温烧结粘接可靠性研究 .天津:天津大学化工学院,2007 Qi Kun.A study of interconnection reliability for low-temperature sintered nano-silver paste .Tianjin:School of Chemical Engineering and Technology,Tianjin University,2007(in Chinese)
[12]	Bai John G,Zhang Zhiye Zach,Jesus N,et al.Low-temperature sintered nanoscale silver as a novel semiconductor device metalized substrate interconnect material[J].IEEE Transactions on Components and Packaging Technologies,2006,29(3):589-593
[13]	Yan Jianfeng,Zou Guisheng,Wang Xiaoyu,et al.Large-scale synthesis of Ag nanoparticles by polyol process for low temperature bonding application //2011 International Conference on Electronic Packaging Technology & High Density Packaging.Shanghai:IEEE/IEE Electronic Library(IEL),2011:254-259
[14]	Bai John G,Lu Guoquan.Thermomechanical reliability of low-temperature sintered silver die attached sic power device assembly[J].IEEE Transactions on Device and Materials Reliability,2006,6(3):436-441
[15]	Zhang Zhiye,Lu Guoquan.Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow[J].IEEE Transactions on Electronics Packaging Manufacturing,2002,25(4):279-283